PAST EVENTS
Workshop
IMS 2022 - Front-end module integration and packaging for 6G and beyond 100GHz communication and radar systems
Location: Denver, CO
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Workshop Chair/organizer: Kevin Gu & Kamal Samanta
Student Design Competition
IMS 2022 - Packaged C-band Filter (with TC-5)
Location: Denver, CO
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Organized SDC IMS2022: Packaged C-band Filter (C. Carceller and K. Samanta with TC-5)
Keynote Talk
EuMW 2021 - Advanced Integration and Packaging of High-Power Components and Amplifiers for 5G/Beyond Industrial Applications
Location: Milan, Italy
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K. Samanta, “Advanced Integration and Packaging of High-Power Components and Amplifiers for 5G/Beyond Industrial Applications”
Workshop
IMS 2021 - Advanced Multichip Modules and Packaging for 5G and Beyond
Location: Atlanta, GA
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Workshop Chair/organizer & Author IEEE IMS 2021: K K Samanta (with TC-14)
Invited Talk
RFIT 2021 - High Power Wide-Band GaN Amplifiers: Industrial Design and Challenges
Location: Taiwan
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Special session Talk, IEEE, MTTs RFIT2021, Taiwan: High Power Wide-Band GaN Amplifiers: Industrial Design and Challenges. By Kamal K Samanta
Invited Talk
IMaRC 2021 - Integration and Packaging of UWB GaN Power Amplifier for Advanced Industrial Applications
Location: Kanpur, India
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Invited Talk, IEEE, MTTs IMaRC 2021: Integration and Packaging of UWB GaN Power Amplifier for Advanced Industrial Appl. By Kamal K Samanta
Keynote Talk
EuMW 2020 - Advanced Multilayer Components and Front-End Modules for Millimetre-Wave and 5G Applications
Location: Utrecht, Netherlands
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K. Samanta, “Advanced Multilayer Components and Front-End Modules for Millimetre-Wave and 5G Applications”
Invited Talk
ESTC 2020 - Heterogeneous Integration Roadmap: 5G Communications
Location: Norway
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Invited Special Talk: IEEE Electronics Systems- Integration Technology Conference (ESTC 2020), Norway, (representing IEEE RF-AMS Working Group) on Heterogeneous Integration Roadmap: 5G Communications. By Kamal K Samanta
Keynote Talk
EuMW 2019 - Wideband GaN PA Design and integration: industrial Challenges and Techniques
Location: Paris, France
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EuMW 2019, Paris, France: on Wideband GaN PA Design and integration: industrial Challenges and Techniques. Delivered by Kamal K Samanta
Workshop
IMS 2019 - Recent Advancement and Trends in 3D heterogeneous integration for mmW 5G and Terahertz
Location: Boston, MA
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Organized & Speaker: IMS2019 (with TC-14): Recent Advancement and Trends in 3D heterogeneous integration for mmW 5G and Terahertz. By Kamal K Samanta
Workshop
IMS 2019 - Advanced Packaging Technologies for High-Performance 5G Front-End Modules
Location: Boston, MA
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Organized IMS2019 (with TC12): Advanced Packaging Technologies for High-Performance 5G Front-End Modules. By Kamal K Samanta
Webinar Presentation
Online - Advance Millimeter-wave and 5G multilayer/3D Integration and Packaging Technologies and Techniques
Location: IEEE MTT Webinar
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IEEE MTTs Webinar Presentation: Advance Millimeter-wave and 5G multilayer/3D Integration and Packaging Technologies and Techniques. April 2018, Kamal K Samanta
https://resourcecenter.mtt.ieee.org/education/webinars/MTTWEB0301.html
Panel Session
IMS 2018 - 5G mmW PA/FEM: Si (RFIC) Vs III-V (MMIC) who will win the race?
Location: Philadelphia, PA
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IMS2018, 10-15 June, Philadelphia: on 5G mmW PA/FEM: Si (RFIC) Vs III-V (MMIC) who will win the race? Moderator & Panelist: Kamal K Samanta
Workshop
IMS 2018 - Module Integration and Packaging/IC Co-Integration for mm-wave Communications and 5G
Location: Philadelphia, PA
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Workshop Chaired/organized, IEEE IMS 2018 (with TC-12): Module Integration and Packaging/IC Co-Integration for mm-wave Communications and 5G. By Kamal K Samanta
Workshop
EuMW 2018 - Recent Advancements in Wide-Band and Efficient GaN Power Amplifiers
Location: Madrid, Spain
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Workshop Chair/organized & Speaker, EuMW 2018 (with TC-12): Recent Advancements in Wide-Band and Efficient GaN Power Amplifiers, by Kamal K Samanta
Invited Talk
IMaRC 2018 - Wideband very high power GaN Amplifiers: Advanced Design, Integration and Packaging Techniques
Location: Kolkata, India
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IMaRC2018: Wideband very high power GaN Amplifiers: Advanced Design, Integration and Packaging Techniques. By Kamal K Samanta
Workshop
EuMC 2017 - Recent Advancements in Wide-Band and Efficient GaN Power Amplifiers
Location: Nuremberg, Germany
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Workshop Organizer & Speaker EuMW2017, Germany, on ‘Recent Advancements in Wide-Band and Efficient GaN Power Amplifiers. K Samanta
TC-16 talk: 5 G Challenges and Potential PA Architectural Solutions, EuMC2017, Germany. K K Samanta
Workshop
IMS 2017 - PAs for 5G Mobile Communication: Technologies and Challenges
Location: Honolulu, HI
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Workshop Organizer & Speaker IMS2017, 5 June, Honolulu (with TC-16), on ‘PAs for 5G Mobile Communication: Technologies and Challenges’ by Kamal K Samanta
Workshop
IMS 2017 - Recent Progresses in mmW Multilayer Circuit and System Design and Packaging (MCM/SoP)
Location: Honolulu, HI
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Workshop Organizer & Speaker IMS2017, 9 June, Honolulu (with TC-5), on “Recent Progresses in mmW Multilayer Circuit and System Design and Packaging (MCM/SoP)”. By Kamal K Samanta
Invited Talk
IMaRC 2017 - 3D/Multilayer Heterogeneous Integration and MCM for Next Generation Applications in Millimeter-Wave and Beyond
Location: Ahmedabad, India
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IEEE MTTs IMaRC2017, Dec2017: 3D/Multilayer Heterogeneous Integration and MCM for Next Generation Applications in Millimeter-Wave and Beyond. By Kamal K Samanta
Industrial Panel Session
EuMW 2016 - Solid-State and Vacuum PAs: Latest Industrial Trends and Future Direction (with TC-12)
Location: London, UK
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