PAST EVENTS
Student Design Competition
IMS 2023 SDC9: mmWave 3D-printed Antenna Design
Location: San Diego, CA
Start date: 2023-06-13
End date:
IMS 2023 SDC9: mmWave 3D-printed Antenna Design
Come to IMS 2023 in San Diego and participate in our Student Design Competition! You can test your mmWave 3D printing antenna design skills and win prize money. Review the description of the competition and rules here. To participate, register at https://ims-ieee.org/2023SDC
The student design competitions will take place on Tuesday, 13 June 2023, with the competition winners recognized at the Student Awards Luncheon on Thursday, 15 June 2023.
Workshop
IMS 2023 Workshop: Advanced Wafer-Level Heterogeneous Integration and Packaging for mm-Wave 5G and 6G Applications
Location: San Diego, CA
Start date: 2023-06-11
End date:
Workshop
IMS 2022 - Front-end module integration and packaging for 6G and beyond 100GHz communication and radar systems
Location: Denver, CO
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Workshop Chair/organizer: Kevin Gu & Kamal Samanta
Student Design Competition
IMS 2022 - Packaged C-band Filter (with TC-5)
Location: Denver, CO
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Organized SDC IMS2022: Packaged C-band Filter (C. Carceller and K. Samanta with TC-5)
Keynote Talk
EuMW 2021 - Advanced Integration and Packaging of High-Power Components and Amplifiers for 5G/Beyond Industrial Applications
Location: Milan, Italy
Start date:
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K. Samanta, “Advanced Integration and Packaging of High-Power Components and Amplifiers for 5G/Beyond Industrial Applications”
Workshop
IMS 2021 - Advanced Multichip Modules and Packaging for 5G and Beyond
Location: Atlanta, GA
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Workshop Chair/organizer & Author IEEE IMS 2021: K K Samanta (with TC-14)
Invited Talk
RFIT 2021 - High Power Wide-Band GaN Amplifiers: Industrial Design and Challenges
Location: Taiwan
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Special session Talk, IEEE, MTTs RFIT2021, Taiwan: High Power Wide-Band GaN Amplifiers: Industrial Design and Challenges. By Kamal K Samanta
Invited Talk
IMaRC 2021 - Integration and Packaging of UWB GaN Power Amplifier for Advanced Industrial Applications
Location: Kanpur, India
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Invited Talk, IEEE, MTTs IMaRC 2021: Integration and Packaging of UWB GaN Power Amplifier for Advanced Industrial Appl. By Kamal K Samanta
Keynote Talk
EuMW 2020 - Advanced Multilayer Components and Front-End Modules for Millimetre-Wave and 5G Applications
Location: Utrecht, Netherlands
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K. Samanta, “Advanced Multilayer Components and Front-End Modules for Millimetre-Wave and 5G Applications”
Invited Talk
ESTC 2020 - Heterogeneous Integration Roadmap: 5G Communications
Location: Norway
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Invited Special Talk: IEEE Electronics Systems- Integration Technology Conference (ESTC 2020), Norway, (representing IEEE RF-AMS Working Group) on Heterogeneous Integration Roadmap: 5G Communications. By Kamal K Samanta
Keynote Talk
EuMW 2019 - Wideband GaN PA Design and integration: industrial Challenges and Techniques
Location: Paris, France
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EuMW 2019, Paris, France: on Wideband GaN PA Design and integration: industrial Challenges and Techniques. Delivered by Kamal K Samanta
Workshop
IMS 2019 - Recent Advancement and Trends in 3D heterogeneous integration for mmW 5G and Terahertz
Location: Boston, MA
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Organized & Speaker: IMS2019 (with TC-14): Recent Advancement and Trends in 3D heterogeneous integration for mmW 5G and Terahertz. By Kamal K Samanta
Workshop
IMS 2019 - Advanced Packaging Technologies for High-Performance 5G Front-End Modules
Location: Boston, MA
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End date:
Organized IMS2019 (with TC12): Advanced Packaging Technologies for High-Performance 5G Front-End Modules. By Kamal K Samanta
Webinar Presentation
Online - Advance Millimeter-wave and 5G multilayer/3D Integration and Packaging Technologies and Techniques
Location: IEEE MTT Webinar
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End date:
IEEE MTTs Webinar Presentation: Advance Millimeter-wave and 5G multilayer/3D Integration and Packaging Technologies and Techniques. April 2018, Kamal K Samanta
https://resourcecenter.mtt.ieee.org/education/webinars/MTTWEB0301.html
Panel Session
IMS 2018 - 5G mmW PA/FEM: Si (RFIC) Vs III-V (MMIC) who will win the race?
Location: Philadelphia, PA
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IMS2018, 10-15 June, Philadelphia: on 5G mmW PA/FEM: Si (RFIC) Vs III-V (MMIC) who will win the race? Moderator & Panelist: Kamal K Samanta
Workshop
IMS 2018 - Module Integration and Packaging/IC Co-Integration for mm-wave Communications and 5G
Location: Philadelphia, PA
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Workshop Chaired/organized, IEEE IMS 2018 (with TC-12): Module Integration and Packaging/IC Co-Integration for mm-wave Communications and 5G. By Kamal K Samanta
Workshop
EuMW 2018 - Recent Advancements in Wide-Band and Efficient GaN Power Amplifiers
Location: Madrid, Spain
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End date:
Workshop Chair/organized & Speaker, EuMW 2018 (with TC-12): Recent Advancements in Wide-Band and Efficient GaN Power Amplifiers, by Kamal K Samanta
Invited Talk
IMaRC 2018 - Wideband very high power GaN Amplifiers: Advanced Design, Integration and Packaging Techniques
Location: Kolkata, India
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IMaRC2018: Wideband very high power GaN Amplifiers: Advanced Design, Integration and Packaging Techniques. By Kamal K Samanta
Workshop
EuMC 2017 - Recent Advancements in Wide-Band and Efficient GaN Power Amplifiers
Location: Nuremberg, Germany
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Workshop Organizer & Speaker EuMW2017, Germany, on ‘Recent Advancements in Wide-Band and Efficient GaN Power Amplifiers. K Samanta
TC-16 talk: 5 G Challenges and Potential PA Architectural Solutions, EuMC2017, Germany. K K Samanta
Workshop
IMS 2017 - PAs for 5G Mobile Communication: Technologies and Challenges
Location: Honolulu, HI
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Workshop Organizer & Speaker IMS2017, 5 June, Honolulu (with TC-16), on ‘PAs for 5G Mobile Communication: Technologies and Challenges’ by Kamal K Samanta
Workshop
IMS 2017 - Recent Progresses in mmW Multilayer Circuit and System Design and Packaging (MCM/SoP)
Location: Honolulu, HI
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End date:
Workshop Organizer & Speaker IMS2017, 9 June, Honolulu (with TC-5), on “Recent Progresses in mmW Multilayer Circuit and System Design and Packaging (MCM/SoP)”. By Kamal K Samanta
Invited Talk
IMaRC 2017 - 3D/Multilayer Heterogeneous Integration and MCM for Next Generation Applications in Millimeter-Wave and Beyond
Location: Ahmedabad, India
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End date:
IEEE MTTs IMaRC2017, Dec2017: 3D/Multilayer Heterogeneous Integration and MCM for Next Generation Applications in Millimeter-Wave and Beyond. By Kamal K Samanta
Industrial Panel Session
EuMW 2016 - Solid-State and Vacuum PAs: Latest Industrial Trends and Future Direction (with TC-12)
Location: London, UK
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