IEEE Journal of Microwaves

About the journal

Open For Paper Submissions

OUR  2023 IMPACT FACTOR IS 6.9 and our Scopus CiteScore is 10.7

Our July issue is coming in less than two weeks…meantime our April 2024 issue is out: get it here!

See the detailed results of our reader and author surveys in: Introduction to the Spring 2024 Issue

******Last Call for Papers for our Special Issue on Microwaves in Climate Change******


JMW’s Paper Download Count now surpasses 575,000!

Ranked #3 of 233 IEEE publications for usage per article for our first two years¹! Our views per article on IEEE Analytics now reads 1635² and our citations per article increased this past year to 12.41, up from 8.3 in July 2023!

JMW’s recidivism rate3 is 34% – join our list of satisfied authors!

Read about our Journal Club review process in our: Introduction to the Summer 2021 Issue

Our January 2021
Inaugural Issue is always accessible at:  January 2021
The full Spring Issue (vol. 1, issue 2) is available at: April 2021
or flip through this Spring Issue: Here

Our Summer Release (vol. 1, issue 3) can be viewed at: July 2021
or flip through this Summer Issue: Here

Our Final Release for 2021 – Fall – (vol. 1, issue 4) is on IEEEXplore at: Oct. 2021
or flip through this Fall Issue: Here

The Winter 2022 issue (vol. 2, issue 1) can be accessed at: Jan. 2022
or flip through this Winter Issue: Here
The Spring 2022 issue (vol. 2, issue 2) can be accessed at: Apr. 2022
or flip through this Spring Issue: HERE
The Summer 2022 issue (vol. 2, issue 3) can be accessed at: Jul. 2022
or flip through this Summer Issue: HERE
Read our summer feature article on IEEE President K. J. Ray Liu: “Follow Multiple Paths, Changing the World with Microwave Time Reversal Focusing
The final 2022 issue – Fall – (vol. 2, issue 4) can be accessed at: Oct. 2022
or flip through this Fall Issue: HERE

The Winter 2023 issue (vol. 3, issue 1) can be accessed at: Jan. 2023
or flip through this Winter Issue: HERE
The Spring 2023 issue (vol. 3, issue 2) can be accessed at: Apr. 2023
or flip through this Spring Issue: HERE
The Summer 2023 issue (vol. 3, issue 3) can be accessed at: Jul. 2023
or flip through this Summer Issue: HERE
The Fall 2023 issue (vol. 3, issue 4) can be accessed at: Oct. 2023
or flip through this final 2023 Fall Issue: HERE

The Winter 2024 issue (vol. 4, issue 1) can be accessed at: Jan. 2024
or flip through this Winter Issue: HERE


About our Journal:

Please Read: “Introduction to IEEE Journal of Microwaves”

Microwaves both documents and celebrates the Renaissance that we are now living through in microwave technology and applications. Microwaves’ unique spectral region spans a wavelength range of more than six decades, from 30 meters to 30 micrometers (MHz-THz). Today, microwave devices are ubiquitous. They are literally the glue that binds our social networks. They crop up in every corner of technology. They cross disciplines as diverse as communications and cooking, and appear in devices and instruments from the millimeter-square silicon chip to the hundred-meter-square tokamak, at power levels from nanowatts to gigawatts. They have been undergoing continuous development for almost one-and-one half centuries, and now they infiltrate almost every aspect of our lives – unseen, unheard, often unnoticed. No longer!

This journal is both a celebration of the successful integration of microwave technology into our world, and a call to arms. Microwave engineering needs converts. Microwave engineering is not dull. All the discoveries in microwave engineering were not made in the 1950’s. On the contrary, we are on a growth trajectory that surpasses anything we could have imagined even ten years ago, and this expansion will continue well into the next decade.

Over the foreseeable future, this journal will help to highlight the science, the technology, the applications, and the accomplishments of researchers in the microwave field. Microwaves strives to be a technical journal of the highest possible caliber, showcasing contributed and rigorously peer-reviewed papers that span the wide range of disciplines and applications that the field encompasses. Microwaves is also an archival teaching platform which will carry invited review articles and selected topical reports that summarize specific experimental methods, technologies, applications, and manufacturing techniques that our renowned editors feel are essential reading for everyone in our discipline. Microwaves will add news and opinions that are helping to shape our community and its influence on society, through contributions from both editors and authors, in order to give perspective to the science and technology advances highlighted in the journal. Finally, Microwaves will anchor our field to the past and catapult us into the future, with historic perspectives and biographies, and special interviews with notable scholars in several continuously running series: Microwave Pioneers, Microwaves are Everywhere, Women in Microwaves, and Breakthroughs in Microwaves.

The IEEE, the Microwave Theory and Technology Society, our contributing editors and reviewers, and especially this founding Editor-in-Chief, all hope that you will embrace this new model for dissemination of our collective research work and the archiving of our accomplishments. I personally implore you to support this journal through your contributions and your readership.

Journal of Microwaves is a model for, rather than simply a participant in, our changing future. (ISSN: 2692-8388, OCLC: 1163785784, Citation Abbreviation: IEEE J. Microwaves)


* Journal logo and cover design by graphic designer Atria Azarmi ( and Peter Siegel

1 The ranking is based on the total usage (downloads and views) listed on IEEE POPP analytics divided by the number of articles published for each IEEE journal surveyed in the indicated period as displayed on IEEEXplore. Since IEEE JMW has only published in 2021 and 2022 the usage/articles published is for this period of time.

2 The usage per article includes views and downloads of all published papers plus all ephemeral content (Table of Contents, cover pages, paper calls, etc.)

3 More than 35% of our authors and co-authors have appeared on multiple submissions