- EuMW Week, EuMC2021, 2-7 April 2022, London: K K Samanta, ‘Advanced Integration and Packaging of High-Power Components and Amplifiers for 5G/Beyond Industrial Applications”.
- IEEE IMS 2022: Front-end module integration and packaging for 6G and beyond 100GHz communication and radar systems. Workshop Chair/organizer: Kevin Gu & Kamal K Samanta
- Guest Edited The First Inter-society (with EPS) Focused Issue for IEEE Microwave Magazine: K. K. Samanta and K. Aygün, “Microwave/Millimeter-Wave Packaging for 5G and Beyond: Materials, Technologies, and Techniques [From the Guest Editors’ Desk],” in IEEE Microwave Magazine, vol. 23, no. 8, pp. 46-49, Aug. 2022
- Invited Journal/Magazine Paper: K. K. Samanta, “Cost-Effective Technologies for Next-Generation System on Package: Multilayer Transmission Lines and Interconnects for 5G and Millimeter-Wave,” in IEEE Microwave Magazine, vol. 23, no. 8, pp. 50-65, Aug. 2022
Student Design Competition
- SDC IMS2022: Packaged C-band Filter (C. Carceller, K. Samanta with TC-5)