‘IMS2023: Perspective from the Top’ Gayle Collins has written an insightful article for the IEEE Microwaves Magazine WIM column on some of her experiences as a woman engineer and how much she is looking forward to the International Microwave Symposium (IMS) 2023 in San Diego: “it will be the coolest show.” The IMS2023 organizing committee […]
‘RWW 2023 WIM Event: Distinguished Women in Microwaves’ The December 2022 Women in Microwaves (WIM) column in IEEE Microwaves Magazine featured an article by Jasmin Grosinger giving us a sneak peek at the exciting WIM event being planned for the 2023 IEEE Radio & Wireless Week (RWW) being held the week of January 22 in […]
Innovative Competition at IMS2022 Showcases the Next Generation of RF/Microwave Designers I had the honor for the fourth year in a row of being the moderator for the Three Minute Thesis (3MT) competition at the International Microwave Symposium (IMS) in June of this year. Now in its sixth year, at IMS, this unique event challenges […]
2023 is a year of rejuvenation; MTT changed its name to Microwave Theory and Technology. With that new name, our Letters will become “IEEE Microwave and Wireless Technology Letters” and will be a rejuvenation and a reborn of our activities and goals. Technology is the motto for this year; MTT is at the center of […]
IEEE Microwave Magazine – January 2023 The January 2023 issue of the IEEE Microwave Magazine is now out. We have a wide variety of features in this issue. We have fabrication features regarding additive manufacturing and gap waveguide technology as well as an energy harvesting feature reviewing rectifier circuits. And who doesn’t love 3D printing? […]
2022 IMS (Denver, CO, USA), June 22-23, 2022 The Inter-Society Technology Panel (ISTP) program aims to strengthen collaborations and idea exchange with other IEEE entities and non-IEEE organizations and lead multidisciplinary and cross-sectorial activities over targeted applications as described in the introductory presentation of this new IEEE Microwave Theory and Technology Society (MTT-S) initiative in […]
2023 IEEE MTT-S Best Paper Awards IEEE Microwave Prize Recognizes, on an annual basis, the most significant contribution by a published paper to the field of interest of the MTT-S. The Microwave Prize is the Society’s oldest Award. Wael Abdullah Ahmad, Maciej Kucharski, Arzu Ergintav, Salah Abouzaid, Jan Wessel, Herman Jalli Ng, and Dietmar Kissinger […]
MTT-S Inter-Society Technology Panel Program 2021 IMS (Virtual), June 22 and 24, 2021 With the blessing of the IEEE Microwave Theory and Technology Society (MTT-S) AdCom, the MTT-S InterSociety Committee (ISC) launched its new initiative in 2020 on the Inter-Society Technology Panel (ISTP), which is poised to reassert the ISC’s well-defined administrative roles within the […]
IEEE Microwave Magazine – December 2022 The last IEEE Microwave Magazine of 2022 is out! And this being the December issue means we get to learn all about the 2023 IEEE Radio & Wireless Week (RWW). We will give you a brief summary here but for the real summary of the issue check out the […]
Recognizing the achievements of its members is an important part of the mission of IEEE. Each year, following a rigorous evaluation procedure, the IEEE Board of Directors confers a selected group of members for elevation to IEEE Fellow. The IEEE Fellow is the highest grade of membership in the IEEE. Less than 0.1% of voting […]
Keynote Talks EuMW Week, EuMC2021, 2-7 April 2022, London: K K Samanta, ‘Advanced Integration and Packaging of High-Power Components and Amplifiers for 5G/Beyond Industrial Applications”. Workshops IEEE IMS 2022: Front-end module integration and packaging for 6G and beyond 100GHz communication and radar systems. Workshop Chair/organizer: Kevin Gu & Kamal K Samanta Publications Guest Edited The […]
Keynote Talk IEEE, MTT-S, EuMW2020 Week, 10-15 Jan,2021 Netherlands: ‘Advanced Multilayer Components and Front-End Modules for Millimetre-Wave and 5G Applications’. By Kamal K Samanta Workshop IEEE IMS 2021: Advanced Multichip Modules and Packaging for 5G and Beyond Invited Talks Special session Talk, IEEE, MTTs RFIT2021, Taiwan: High Power Wide-Band GaN Amplifiers: Industrial Design and Challenges. […]
Keynote Talks IEEE, MTT-S, EuMW2020, Netherlands: ‘Advanced Multilayer Components and Front-End Modules for Millimetre-Wave and 5G Applications’. Kamal K Samanta Invited Talks Invited Special Talk: IEEE Electronics Systems- Integration Technology Conference (ESTC 2020), Norway, (representing IEEE RF-AMS Working Group) on Heterogeneous Integration Roadmap: 5G Communications. By Kamal K Samanta
Keynote Talks EuMW 2019, Paris, France: on Wideband GaN PA Design and integration: industrial Challenges and Techniques. Delivered by Kamal K Samanta Workshops Organized & Speaker: IMS2019 (with TC-14): Recent Advancement and Trends in 3D heterogeneous integration for mmW 5G and Terahertz. By Kamal K Samanta Organized IMS2019 (with TC12): Advanced Packaging Technologies for High-Performance […]
Publications Guest Edited Focused Issue for IEEE Microwave Magazine (with TC-14): K. K. Samanta and D. Kissinger, “Multilayer Millimeter-Wave MCMs [From the Guest Editors’ Desk],” in IEEE Microwave Magazine, vol. 19, no. 1, pp. 20-135, Jan.-Feb. 2018 Invited Paper: K. K. Samanta, “Ceramics for the Future: Advanced Millimeter-Wave Multilayer Multichip Module Integration and Packaging,” in […]
Publications Guest Edited Focused Issue for IEEE Microwave Magazine (with TC-14): K. K. Samanta and D. Kissinger, “Heterogeneous Integration [From the Guest Editors’ Desk],” in IEEE Microwave Magazine, vol. 18, no. 2, pp. 14-16, March-April 2017 Invited Paper: K. K. Samanta, “Pushing the Envelope for Heterogeneity: Multilayer and 3-D Heterogeneous Integrations for Next Generation Millimeter- […]
