2023 is a year of rejuvenation; MTT changed its name to Microwave Theory and Technology. With that new name, our Letters will become “IEEE Microwave and Wireless Technology Letters” and will be a rejuvenation and a reborn of our activities and goals. Technology is the motto for this year; MTT is at the center of […]
IEEE Microwave Magazine – January 2023 The January 2023 issue of the IEEE Microwave Magazine is now out. We have a wide variety of features in this issue. We have fabrication features regarding additive manufacturing and gap waveguide technology as well as an energy harvesting feature reviewing rectifier circuits. And who doesn’t love 3D printing? […]
2022 IMS (Denver, CO, USA), June 22-23, 2022 The Inter-Society Technology Panel (ISTP) program aims to strengthen collaborations and idea exchange with other IEEE entities and non-IEEE organizations and lead multidisciplinary and cross-sectorial activities over targeted applications as described in the introductory presentation of this new IEEE Microwave Theory and Technology Society (MTT-S) initiative in […]
2023 IEEE MTT-S Best Paper Awards IEEE Microwave Prize Recognizes, on an annual basis, the most significant contribution by a published paper to the field of interest of the MTT-S. The Microwave Prize is the Society’s oldest Award. Wael Abdullah Ahmad, Maciej Kucharski, Arzu Ergintav, Salah Abouzaid, Jan Wessel, Herman Jalli Ng, and Dietmar Kissinger […]
MTT-S Inter-Society Technology Panel Program 2021 IMS (Virtual), June 22 and 24, 2021 With the blessing of the IEEE Microwave Theory and Technology Society (MTT-S) AdCom, the MTT-S InterSociety Committee (ISC) launched its new initiative in 2020 on the Inter-Society Technology Panel (ISTP), which is poised to reassert the ISC’s well-defined administrative roles within the […]
IEEE Microwave Magazine – December 2022 The last IEEE Microwave Magazine of 2022 is out! And this being the December issue means we get to learn all about the 2023 IEEE Radio & Wireless Week (RWW). We will give you a brief summary here but for the real summary of the issue check out the […]
Recognizing the achievements of its members is an important part of the mission of IEEE. Each year, following a rigorous evaluation procedure, the IEEE Board of Directors confers a selected group of members for elevation to IEEE Fellow. The IEEE Fellow is the highest grade of membership in the IEEE. Less than 0.1% of voting […]
Keynote Talks EuMW Week, EuMC2021, 2-7 April 2022, London: K K Samanta, ‘Advanced Integration and Packaging of High-Power Components and Amplifiers for 5G/Beyond Industrial Applications”. Workshops IEEE IMS 2022: Front-end module integration and packaging for 6G and beyond 100GHz communication and radar systems. Workshop Chair/organizer: Kevin Gu & Kamal K Samanta Publications Guest Edited The […]
Keynote Talk IEEE, MTT-S, EuMW2020 Week, 10-15 Jan,2021 Netherlands: ‘Advanced Multilayer Components and Front-End Modules for Millimetre-Wave and 5G Applications’. By Kamal K Samanta Workshop IEEE IMS 2021: Advanced Multichip Modules and Packaging for 5G and Beyond Invited Talks Special session Talk, IEEE, MTTs RFIT2021, Taiwan: High Power Wide-Band GaN Amplifiers: Industrial Design and Challenges. […]
Keynote Talks IEEE, MTT-S, EuMW2020, Netherlands: ‘Advanced Multilayer Components and Front-End Modules for Millimetre-Wave and 5G Applications’. Kamal K Samanta Invited Talks Invited Special Talk: IEEE Electronics Systems- Integration Technology Conference (ESTC 2020), Norway, (representing IEEE RF-AMS Working Group) on Heterogeneous Integration Roadmap: 5G Communications. By Kamal K Samanta
Keynote Talks EuMW 2019, Paris, France: on Wideband GaN PA Design and integration: industrial Challenges and Techniques. Delivered by Kamal K Samanta Workshops Organized & Speaker: IMS2019 (with TC-14): Recent Advancement and Trends in 3D heterogeneous integration for mmW 5G and Terahertz. By Kamal K Samanta Organized IMS2019 (with TC12): Advanced Packaging Technologies for High-Performance […]
Publications Guest Edited Focused Issue for IEEE Microwave Magazine (with TC-14): K. K. Samanta and D. Kissinger, “Multilayer Millimeter-Wave MCMs [From the Guest Editors’ Desk],” in IEEE Microwave Magazine, vol. 19, no. 1, pp. 20-135, Jan.-Feb. 2018 Invited Paper: K. K. Samanta, “Ceramics for the Future: Advanced Millimeter-Wave Multilayer Multichip Module Integration and Packaging,” in […]
Publications Guest Edited Focused Issue for IEEE Microwave Magazine (with TC-14): K. K. Samanta and D. Kissinger, “Heterogeneous Integration [From the Guest Editors’ Desk],” in IEEE Microwave Magazine, vol. 18, no. 2, pp. 14-16, March-April 2017 Invited Paper: K. K. Samanta, “Pushing the Envelope for Heterogeneity: Multilayer and 3-D Heterogeneous Integrations for Next Generation Millimeter- […]
IEEE Awards IEEE Electromagnetics Award which is a prestigious IEEE Technical Field Award for outstanding contributions to the theory and/or application of electromagnetics. John W. Bandler for contributions to electromagnetic optimization and the modeling of high-frequency structures, circuits, and devices. IEEE Transportation Technologies Award which is a prestigious IEEE Technical Field Award for advances in technologies […]
IEEE Microwave Magazine – November 2022 The November issue of the IEEE Microwave Magazine is out. And Happy 70th birthday to the MTT society! In our issue we have ten columns dedicated to different aspects of the MTT-S over the past 70 years. And that’s in addition to our regular features and columns. The features […]
Fauziahanim Binti Che Seman is featured in the September issue of IEEE Microwaves Magazine discussing her experiences as a woman in microwaves, where she believes the keys to success include networking, making connections, reputation, and mentoring. She states that networking starts within a small circle of people linked by mutual interests and meaningful communication, strengthened […]
