DOI: 10.1109/TMTT.2026.3706283

IEEEXplore: https://ieeexplore.ieee.org/document/11597915

Phrase Summary:

Contactless air-filled waveguide using stacked PCB technology.

Sentence Summary:

This article presents a low-loss, cost-effective contactless air-filled waveguide implemented using stacked PCB technology for 77-GHz automotive radar components.

Paragraph Summary:

This article presents a low-loss, cost-effective contactless air-filled (CLAF) waveguide implemented using stacked printed circuit board (PCB) technology as a viable solution for 77-GHz automotive radar components.  The CLAF waveguide design uses a new mirror-stacked glide-symmetric mushroom electromagnetic bandgap (EBG) structure that demonstrated a wider bandgap than conventional structures, making it suitable for a lower cost contactless air-filled waveguide solution.  Measured S-parameters showed good agreement with the simulation.  Average measured attenuation of 0.13 dB/cm was achieved for the mmWave automotive radar frequency band of 76–81 GHz.  The design is compatible with next-generation radar chips incorporating vertical waveguide launchers in LiP/LoP technology.