TC-16 Technical Activities in 2017

Publications

• Guest Edited Focused Issue for IEEE Microwave Magazine (with TC-14): K. K. Samanta and D. Kissinger, “Heterogeneous Integration [From the Guest Editors’ Desk],” in IEEE Microwave Magazine, vol. 18, no. 2, pp. 14-16, March-April 2017

• Invited Paper: K. K. Samanta, “Pushing the Envelope for Heterogeneity: Multilayer and 3-D Heterogeneous Integrations for Next Generation Millimeter- and Submillimeter-Wave Circuits and Systems,” in IEEE Microwave Magazine, vol. 18, no. 2, pp. 28-43, March-April 2017

Workshops

• K. Samanta, “5 G Challenges and Potential PA Architectural Solutions” on workshop “Recent Advancements in Wide-Band and Efficient GaN Power Amplifiers”, EuMW2017, Germany

Invited Talks

• 3D/Multilayer Heterogeneous Integration and MCM for Next Generation Applications in Millimeter-Wave and Beyond