IEEE Microwave Magazine – October 2019
The October issue of the IEEE Microwave Magazine is out. The theme for this issue is Silicon-Ceramic (SiCer) substrates and is brought to us by the Microwave Acoustics technical committee. We have four feature articles and three of them focus on how low temperature confirmed ceramic can combine with Silicon chips and take us where printed circuit boards cannot go. Evolving RF systems, MEMs resonators and BAW or FBAR resonators as well as switches form a next generation of products. The last article focuses on oscillators in SiCer systems. There is lots of information on design, modeling and measurements in these articles so there is something for everyone. A cousin of a feature article is an Application Note. This issue has something everyone who has worked on baluns, power amplifiers and mixers will enjoy – a note on how to model the implementation of coaxial baluns in microstrip circuitry. The various ground references can get tricky and this article will show you how to sort it out.