Events

Session: WMC
Organizers: Charles Baylis / Andrew Clegg
Affiliation: Baylor University / Google

Abstract:
This workshop will discuss radio spectrum usage from the view of a microwave practitioner. The basics of wireless spectrum allocation and regulation will be discussed. Presentations will describe the spectrum needs and challenges for defense and the commercial wireless industry, as well as how the test and measurement industry will be challenged. Core microwave technology innovations enabling future innovative spectrum usage will be discussed, including mm-wave devices and reconfigurable circuitry. Finally, a discussion of workforce development for spectrum science and engineering will conclude the presentations. The workshop will include an opening discussion and audience poll for topics of interest, as well as a closing panel session with the speakers for additional participant interaction.

Agenda:

1. “Opening Discussion: Challenges in Wireless Spectrum Use”
2. “Introduction to the Electromagnetic Spectrum” Andrew Clegg– Google
3. “Spectrum Regulation: As Real as Maxwell’s Equations” Ira Keltz – FCC
4. “Current Spectrum Sharing Deployments and Plans” Monisha Ghosh – University of Notre Dame
5. “Commercial Wireless Challenges for Microwave Designers” Tom Willis – AT&T Labs
6. “Spectrum Needs and Challenges for Defense” Kelly Sherbondy – Army Research Laboratory
7. “mm-Wave Devices to Expand Spectrum Usage” Robert M. Weikle – University of Virginia
8. “Reconfigurable Circuitry for Adaptive Microwave Spectrum Sharing Systems” Charles Baylis – Baylor University
9. “The Use of Artificial-Intelligence in Radio Spectrum” Robert J. Marks– Baylor University
10. “Test and Measurement in the Changing Spectral Environment” Nizar Messaoudi – Keysight Technologies
11. “Workforce Development in the Changing Spectral Environment” Rashaunda Henderson – University of Texas at Dallas
12. “ Closing Panel: Answering Today’s Challenges and Addressing Future Considerations”

Session: WSM
Organizers: Bahar Jalali Farahani / Mahdi Parvizi / Salvatore Finocchiaro / Ko-Tao Lee
Affiliation: Cisco / Qorvo

Abstract:
As the Moore’s law is coming to an end, separating large systems into smaller chips based on their functionality is not only a cost-benefit solution but it allows the complex system to expand beyond theoretical size limits. Although chiplet technology has been around for many years, it has not been till the rise of the AI supercomputers and the accompanied unprecedented computational demand that put the spotlight on SiPs (System in Package). There are different aspects to the design of chiplets including the packaging, the high-speed chip-to-chip interconnect and the interoperability and standardization which allow the SiP built by the combination of chips from different vendors. There are multiple benefits to the chiplet-based architectures. Breaking down the large complex systems into smaller chips based on their functionality means better yields and lower cost due to the lower probability of manufacturing defects. Cost reduction can also come with customizing the process technology for each chiplet (eg using advanced nodes for GPUs and CPUs and less expensive technologies for memories and analog interfaces). Design upgrades can also be done on certain functional blocks without the need for redesigning the whole system. To take full advantage of chiplet-based architectures, the D2D (die-to-die) interface needs to be standardized. The interoperability allows the developer to use multiple vendors. In terms of the packaging, development of 3DHI (3D Heterogeneous Integration) that enables stacking up separately manufactured components, is the perfect technology choice for chiplet-based architectures. Additionally, the ever-increasing demand for high-throughput communication links and high-resolution radar sensors is driving the development of future wireless systems at higher operating frequencies. In order to support multiple functionality, the flexibility requested to those systems, is driving the adoption of large phased array antennas. Heterogeneous technologies and vertical 3D integration will play a vital role in enhancing the performance and functional density, along with reducing the size and costs, of such RF systems. In addition to the already mentioned standardization, both on the digital and RF side, 3DHI will pose a new set of technology (processes and substrates), design (MMICS, RFIC, analog, power management, passives), packaging and thermal challenges. This workshop will address some of the challenges mentioned above both from the digital and RF point of view, combining commercial and defense perspectives with state-of-the-art research in the field. Experts from industry and academia that are at the frontline of these developments are invited to address these issues and inform the audience about the latest advances in this field.

Agenda:

1. “The Motivation for Chiplets” Subramanian Iyer – University of California, Los Angeles
2. “Chiplet Interconnect Solutions” Ramin Farjadrad – Eliyan
3. “Package-to-Package Scale-Out Interconnect Solutions Based on In-Package Optical I/O” Miloš Popović – Ayar Labs
4. “Die-to-Die Interconnect Based on Micro-LED Arrays” Bardia Pezeshkit – Avicena
5. “Vertical Stacking with Si-Cored Substrates” Steven Verhaverbeke – Applied Materials
6. “Glass-Based Stitch-Chip Technologies and Advanced Packaging for mm-Wave HI” Muhannad S. Bakir – Georgia Tech
7. “Building >100GHz Phased Array Systems using Standard 3D Integration Technologies” Gabriel M. Rebeiz – University of California, San Diego
8. “3D Integration of ICs and Antennas for Ubiquitous mm-Wave Arrays” Arun Natarajan – Oregon State University
9. “Thermal Management for 3DHI and Advanced Packaging” Robert Pearson – Lockheed Martin
10. “3D Heterogenous Integration (3DHI) for Advanced Communications” Madhavan Swaminathan – Penn State University

Session: WSC
Organizers: Gabriele Formicone / David Brown
Affiliation: Integra Technologies / BAE Systems

Abstract:
This workshop gathers together world experts, research and industry leaders to report and discuss the latest RF/MW technology developments that continue to drive innovation in high-power applications in Aerospace & Defense, as well as in ISM. Specific areas of interest discussed in this workshop span from vacuum tubes (VEDs) to solid-state transistors for active devices, to circuit design and techniques, as well as specific applications that leverage the benefits of the evolving technology. This full-day workshop is geared towards practitioners in the high-power RF/MW aerospace, defense, industry, scientific and medical areas who want to gain a broader perspective on the latest technology developments as well as nuances specific to each different application. Novices and newcomers to the A&D and ISM industry will also gain a comprehensive exposure and understanding of the RF/MW landscape that drives innovation in this specific arena.

Agenda:

1. “Traveling Wave Tube Amplifiers for Space System Transmitters” Andrew Moulthrop and Michael S. Muha – Aerospace
2. “Development of High-Power Vacuum Electron Devices for Radar” Monica Blank, Mohamed D. Abouzahra, and Michael MacDonald – CPI and MIT Lincoln Laboratory
3. “High-Power RF Technology for Solid-State Radar” Nestor Lopez, Michael MacDonald, and Mohamed D. Abouzahra – BAE Systems and MIT Lincoln Laboratory
4. “Technology Options for Phased Array Beamforming” Frank E. van Vliet – TNO
5. “Overview of Modern High-Power Microwave (HPM) Technologies and Challenges” Feyza Berber Halmen, Travis Fields, and Roy C. Allen – MIDE
6. “High-Power RF Pallet and Transistor Solutions for Radar and Avionic Systems from UHF to S-Band” John Walker and James Custer – Integra Technologies
7. “High-Power RF/Microwave Systems in Medical and Agricultural Applications” Paolo F. Maccarini – Duke University
8. “Solid-State Amplifiers for Noninvasive Thermo-Acoustic Imaging to Diagnose Liver Fat and Other Medical Applications” Chris Davis – ENDRA Life Sciences
9. “The Role of RF Technology in MR Imaging (MRI) Systems” Daniel Myer – CPC
10. “Build-a-Radar Self-Paced Massive Open Online Course (MOOC) for Students of All Backgrounds” Kenneth E. Kolodziej – MIT Lincoln Laboratory

Session: WSF
Organizers: Didier Belot / Pierre Busson
Affiliation: STMicroelectronic

Abstract:
The 6G Telecom generation forecasts mm-wave and sub-THz applications as Fronthaul and Backhaul mm-wave and sub-THz wireless links; Reflective Intelligent Surface between mini-cell station and devices mainly in mm-wave frequency range; Short distance ultra-high data-rate mm-wave and sub-THz wireless data storage transfer; Automotive Joint communication and Sensing Radars; Health and Industrial mm-wave and sub-THz Radars and imagers; and other applications which are not yet defined. A Key challenge facing us is how to manage multi-processes dies with antennas integrated in the same object, reducing losses, and then increasing power efficiency and, at the same time targeting the cost efficiency. The workshop will discuss the trade-off Power Efficiency/Cost Efficiency of different 3D assembly strategies and will try to have a picture of the most promising research in the domain, through topics which will address as III-V GaN/Si and InP/Si, with SiGe and or CMOS Heterogeneous Integration; Wafer to Wafer; Die to Wafer, Backend of line co-integration; mm-wave sub-THz packaging, including Antenna integration, Si-Interposers, organic interposers, and other packaging 3D approach. The power efficiency can be defined as the max data rate ability, with the max distance covered by the transceiver over its power consumption, the cost efficiency is max data rate ability, with the max distance covered by the transceiver over its cost. This simple relation does not take into account the cooling equipment, if necessary, the reliability, and finally the environmental impact of the different strategies. These last points are difficult to quantify at the research level.

Agenda:

1. “System-on-Wafer: 2D and 3D Technologies for Heterogeneous Systems” Hervé Boutry, Olivier Valorge, and Christophe Dubarry – CEA-LETI
2. “RF-Heterointegration at Wafer-Level and Panel-Level for mm-Wave Applications” Siddhartha Sinha and Nadine Collaert – IMEC
3. “Material and Packaging Trends for High Frequency mm-Wave Applications” Tanja Braun – Fraunhofer IZM
4. “Heterointegration Approaches for InP-HBT Technologies for 5G Applications and Beyond” Hady Yacoub and Wolfgang Heinrich– FBH

Session: TU-B1
Organizers: Ko-Tao Lee / Seanchy H.-C. Chiu
Affiliation: Qorvo / Wavetek Microelectronics

Abstract:
The rapid development of GaN technology has revolutionized the RF industry, enabling high frequency, high power, and high efficiency operations for RF systems across multiple market segments. In the telecommunications industry, GaN RF technology has been widely used to improve data rate, increase signal coverage, and reduce power consumption for 5G/6G base stations. As for the aerospace industry, GaN is used for satellite communication to ensure smooth and reliable uplink and downlink. In the defense sector, it is implemented in electronic warfare systems to detect and neutralize the attackers’ radar systems. To explore the latest development of GaN RF technology, the workshop is being organized featuring 6 technical experts from the RF semiconductor industry as the speakers. It is a great opportunity for participants to learn the current status as well as future challenges of GaN RF technology from different perspectives, including material science, device physics, technology development, and system applications.

Agenda:

1. “Performance and reliability improvements of GaN RF HEMTs for sub-6 GHz and mmWave applications” Yu-Syuan Lin – WIN Semiconductors
2. “Mitsubishi Electric’s GaN device developments for 5G and beyond 5G/6G” Koji Yamanaka – Mitsubishi Electric
3. “The state of GaN transistor technology today. Challenges and opportunities for the future” Jose Jimenez – Qorvo
4. “The application and challenges of RF GaN HEMT on Si substrate” Seanchy Hsien-Chin Chiu – Wavetek Microelectronics
5. “Development of GaN-on-Si technology for the next generations of RF systems” Bertrand Parvais – IMEC
6. “Potential and challenges of N-polar MIS GaN HEMT for post 5G wireless network” Kozo Makiyama – Sumitomo Electric Industries

Session: WM6
Organizers: Kenjiro Nishikawa / Kazuya Yamamoto
Affiliation: Kagoshima University / Mitsubishi Electric

Abstract: More than three years have passed since 5G services started in several country’s carriers. 5G sub-6 GHz services, so-called FR1 services, are rapidly becoming popular in cellular communications. However, 5G mmwave services, so-called FR2 (28 to 39GHz) services have NOT been popular still now. From a viewpoint of device technology, in the sub-6GHz base stations, GaN HEMTs are becoming a main player for higher efficiency operation, compared to Si-LDMOS. In contrast, in the mm-wave base stations, Si-based transistors, such as SiGe HBT and SOI-CMOS, contribute to the realization of most of the real FR2 systems. This workshop will introduce REAL base station techniques and their supporting REAL device techniques for 5G and beyond 5G mm-wave systems. The feature of this workshop is that the latest information of not only Si-based MIMO and related devices but also GaN-based MIMO and related devices is given at a time. The workshop attendees, therefore, will be able to learn and understand a variety of technical issues, their countermeasures, and the latest results related to base station transmitters and devices of 5G FR2 at a time. Thus, it is expected that this workshop will be very useful for 5G amplifier designers; students, beginners or less-experienced circuit/device designers as well as experienced designers engaged in circuit- and device-suppliers for use in 5G and beyond 5G systems.

Agenda:

1. “5G and Beyond 5G mm-Wave Market Trend and Related Technical Requirements” Yasunori Suzuki – NTT docomo
2. “Millimeter-Wave Colocated- and Distributed-Massive-MIMO, its Spatial Division Multiplexing Selectivity and Energy Efficiency” Tomoya Kaneko – NEC
3. “Advanced Millimeter-Wave GaN Power Amplifiers for BTS” Takuma Torii – Mitsubishi Electric
4. “Highly Scalable GaN Processes for Millimeter Wave Front-End MMICs” Rémy Leblanc – OMMIC SAS
5. “Qorvo mm-Wave MMIC Technology for 5G and Beyond” Shuoqi Chen – Qorvo

Session: Th1G-4
Speaker: Jeong-sun Moon
Affiliation: HRL

Abstract:
Realizing high-performance mm-Wave 5G and beyond communication systems will require transistors with higher linearity and efficiency than current technology options. While GaN HEMTs offer excellent power density, their limited linearity and efficiency compromise overall system performance; this requires substantial DC power consumption and power back-off to circumvent. Here, we will present the linearity and efficiency of graded-channel GaN HEMTs with the linearity figure-of-merit, OIP3/PDC, of 20 dB at 30 GHz, well beyond the 10 dB rule of thumb. For power amplifier applications, a twotone PAE of 62% was obtained experimentally at 30 GHz, which is a state-of-the-art result. We find that ~3 dB back-off from peak PAE is sufficient to achieve a carrier to third-order intermodulation (C/IM3) ratio of 30 dBc. Recent Ka-band and Wband MMICs with graded-channel GaN technology illustrate their potential for future linear and efficient mmW applications. We will talk about challenges associated with accurate linearity and efficiency modeling and validation at mmW MMICs.

Session: Connected Futures Summit
Speaker: Pascal Chevalier 
Affiliation: STMicroelectronics

Abstract:
Exhibiting very steep growth, the deployment of Low Earth Orbit (LEO) satellite constellations is accompanied by a significant volume of user terminals (UT). Designed to track the satellites using phased-array antennas, UTs are key components and require the use of technologies optimized to meet performance targets and ready for consumer-like volumes.
This talk will discuss how Silicon Germanium (SiGe) BiCMOS, a long-standing technology at ST, addresses UT challenges thanks to its best-in-class performance in terms of noise figure, a key parameter as it directly links system performance with effective throughput.
We will look at how ST’s SiGe BiCMOS technology is used in the RF Front-End of several hundred elements per antenna. In addition to looking at the technology serving current UT production (B9MW), we will see what is being developed for the next generation of user terminals (B55X).

Session: WSL
Organizers: Farid Mejdjoub / Keisuke Shinohara
Affiliation: CNRS – IEMN / Teledyne Scientific & Imaging

Abstract:
Owing to superior electrical and thermal properties of GaN-on-SiC material systems, a tremendous progress has been made on GaN-based transistor and MMIC technologies. Advanced heterostructure material designs, epitaxial growth techniques, and transistor scaling processes enabled GaN MMICs to extend their applications from microwave to millimeter-wave frequencies (up to W-band). Next-generation RF systems require high efficiency and high linearity for more complex modulation schemes to support very high data rates. The traditional trade-off among efficiency, linearity, and power density imposes performance limitations on GaN MMICs, which become more pronounced at millimeter-wave frequencies. In this workshop, world-leading experts will discuss present status, challenges, and future perspective of millimeter-wave GaN transistor and MMIC technologies, covering emerging materials and devices, device modeling, thermal management, reliability, and circuit designs.

Agenda:

1. “Broadband mmW GaN MMICs: Technology Aspects and Design Examples” Fabian Thome – IAF Fraunhofer
2. “N-polar GaN devices for efficiency and linearity” Matthew Guidry – UC Santa Barbara
3. “High efficiency high robustness mmW AlN/GaN transistors” Farid Medjdoub – CNRS IEMN
4. “Progress in Highly linear and efficient mm-Wave GaN HEMTs and MMIC” Jeong-sun Moon – HRL
5. “Polarization-Engineered III-N mm-Wave Transistors for Linearity, Efficiency, and Reconfigurability” Patrick Fay – University of Notre Dame
6. “GaN transistor reliability drivers – Temperature and electric fields” Martin Kuball – University of Bristol
7. “The interplay between deep level effects and reliability in deep submicron-gate GaN HEMTs for rf applications” Enrico Zanoni – University of Padova
8. “N-polar GaN HEMT Technology for Millimeter-wave Amplifiers using Commercial 4-inch Wafer Process Facilities” Kozo Makiyama – Sumitomo Electric Industries
9. “ScAlN/GaN Heterostructure Field Effect Transistors for Ultra-high Power and Wide-band MMICs” Eduardo Chumbes – Raytheon
10. “GaN Transistor Designs for Millimeter-Wave Applications” Keisuke Shinohara – Teledyne Scientific and Imaging

Session: TU2-F5
Organizers: Kenjiro Nishikawa / Kazuya Yamamoto
Affiliation: Kagoshima University / Mitsubishi Electric

Abstract:
GaN HEMT modeling and its-based power amplifier design play the important role in realizing current microwave/millimeter-wave communications and radars systems. This course presents fundamentals of GaN HEMT modeling design. It also provides basics of power amplifier design while focusing on GaN HEMT-based high-efficiency power amplifiers. The presenters are a device and modeling engineers of the worldwide GaN leading suppliers and two experienced circuit designers of current GaN PAs. Therefore, attendees will be able to learn the circuit design methodology of power amplifiers as well as GaN HEMT modeling.

Course Syllabus:

1. “Fundametals and Modeling Techniques of GaN HEMT for Microwave Power Amplifiers” Hiroshi Yamamoto – Sumitomo Electric Industries
2. “Fundamentals of Microwave Power Amplifier Design” Yuji Komatsuzaki and Shuichi Sakata – Mitsubishi Electric

Session: Plenary – 3
Speaker: Michael Schroter
Affiliation: Technische Universität Dresden

Session: 12th Tom Brazil Doctoral School of Microwaves
Chair: David Ricketts
Affiliation: North Carolina State University

Program:
09:00 – 10:40 Introduction and Theory of FMCW Radars and System Simulation of a 2.4 GHz Radar
10:40 – 11:20   Coffee Break
11:20 – 13:00   Hands-on Session 1: Radar Component Design and Simulation
13:00 – 14:20   Lunch
14:20 – 16:00   Hands-on Session 2 : Radar Component Fabrication
16:00 – 16:40   Coffee Break
16:40 – 17:30   Hands-on Session 3: Radar component testing and system assembly
17:30 – 18:20   Testing of Radars with Teams
18:20 – 18:30  Tom Brazil Fellowship Awards shortlist announcement

Session: WMH
Organizers: Michael Schroter / Peter Zampardi
Affiliation: Technische Universität Dresden / Qorvo

Abstract:
The focus of the workshop is to provide an overview on transistor performance limits in terms of reliably achievable RF output power of various semiconductor technologies that are presently competing for mobile radio-frequency (RF) applications such as 5G, 6G, automotive radar and imaging, operating in the mm-wave frequency range (ie 30GHz to 300GHz). Of particular interest here are power amplifiers, oscillators, Mach-Zehnder-interferometers, and all sorts of RF buffer circuits that drive transistors to their dynamic large-signal limits and are implemented in semiconductor technologies such as III-V HBTs, SiGe HBTs and FDSOI-CMOS. The presentations will explore the presently quite heterogeneous approaches for determining the transistor related safe-operating-area in terms of reliability and ruggedness for designing circuits that are supposed to deliver high output power at high frequencies in mobile applications. The workshop starts with a tutorial on the design specifications of the above mentioned circuits and the corresponding requirements for large-signal dynamic transistor operation up to the mm-wave region. Based on this motivation, several presentations will outline, for each of the technologies, the state-of-the-art of transistor characterization for RF ruggedness as well as the device physics that cause degradation and the modeling approaches for including reliability aspects in process design kits. The workshop concludes with a tutorial on existing measurements methods for large-signal device testing in the mm-wave range.

Agenda:

1. “Mobile Large-Signal RF Circuits: Design Perspective” Nils Pohl – Ruhr-Universität Bochum
2. “Characterizing and Modeling of Safe Operating Area for SiGe NPNs in Tower’s SBC18 Technology” Samir Chaudhry – Tower Semiconductor
3. “Load-Pull Based RF Reliability Investigations of SiGe HBTs” Michael Schroter – Technische Universität Dresden
4. “III-V HBT Reliability” Brian Moser – Qorvo
5. “III-V HBT Reliability Related Device Physics” Peter Zampardi – Qorvo
6. “22FDX MOSFET Technology — RF/mm-Wave Reliability” Wafa Arfauoi – GLOBALFOUNDRIES
7. “VNA-Based Large-Signal Characterization of Electronic Devices at Sub-mm-Wave Frequencies” Luca Galatro – Vertigo Technologies

Session: WMI
Organizers: Ko-Tao Lee / Guillaume Callet
Affiliation: Qorvo / Mitsubishi Electric

Abstract:
Advances in GaN/GaAs technology and integration development have enabled RF module switching at extremely high frequency that Si devices can’t withstand. It has shaped the landscape of RF industry and enabled applications in mmWave frequency bands. In this full-day workshop, 9 talks will be presented from industrial leaders and technical experts across the globe. It covers the major breakthrough from the latest development of GaN/GaAs technology and integration, including 1) heterogeneous integration of GaN/GaAs MMIC, 2) exploratory RF devices for mmWave, and 3) applications and use-cases for mmWave technologies. In the closing of the workshop, an interactive panel discussion will be conducted between speakers and audiences.

Agenda:

1. “Emerging Millimeter Wave Device and Integration Technology – Next Generation GaN and Beyond” Thomas E. Kazior – DARPA
2. “Millimeter-Wave Scalable Unconstrained Broadband Arrays (MMW SCUBA)” Ryan Walsh – Northrop Grumman
3. “Advanced Interconnects for Heterogeneous Integration of GaN and GaAs RF MMICs” Deep Dumka – Qorvo, Inc.
4. “Millimeter wave GaN MMICs for 5G and satellite communication systems” Koji Yamanaka – Mitsubishi Electric
5. “MMIC and integration technologies for best-in-class mm-Wave component solutions from 24 GHz up to E-band” Jesse Riedl – United Monolithic Semiconductors
6. “Compound Technologies Advancement for mmWave Applications – from a Commercial Foundry Perspective” Barry J. Lin – Wavetek Microelectronics
7. “Research and Development of GaN-based HEMTs for Millimeter- and Terahertz-Wave Wireless Communications” Issei Watanabe – National Institute of Information and Communications Technology
8. “GaN integration in FOWLP” Michael Pretl – Rohde and Schwarz
9. “Integrated compound semiconductor circuits – a 6G communications systems perspective” Kristoffer Andersson – Ericsson

Session: WSD
Organizers: Didier Belot / Wolfgang Heinrich
Affiliation: CEA-LETI / FBH

Abstract:

Telecom communities are beginning to prepare the next generation of mobile telecom, the 6G, and present KPIs going to the Tbps, 300GHz carrier frequency, space multiplexing, spectrum agility, dense Massive MIMO, wide bands, and so forth. Serving these challenges, microelectronics communities must re-think their medium term roadmap: what role can CMOS processes play? Is SiGe HBT a good answer to these KPIs? Do we need more exotic technologies such as III-V HBT or HEMT? How to do Heterogeneous Integrations, in a 3D approach? How to integrate antennas and passives?

Agenda:

1. “Toward 6G: From New Hardware Design to Wireless Semantic and Goal-Oriented Communication Paradigms” Emilio Calvanese Strinati – CEA-LETI
2. “Technology Challenges for 6G” Nadine Collaert & Piet Wambacq – IMEC
3. “Advanced 200mm and 300mm RF SOI and BiCMOS Technologies Targeting 5G and Beyond (6G) RF Front-End Module SOC” Frederic Gianesello – STMicroelectronics
4. “SiGe HBT for mm-Wave and THz Applications” Mohamed Hussein Eissa – IHP
5. “2.5D and 3D Integrations for mm-Wave and THz Applications” Tanja Braun – Fraunhofer IZM
6. “FinFET CMOS for mm-Wave Applications” Stefano Pellerano & Said Rami – Intel
7. “InP HBT for mm-Wave and THz Applications” Wolfgang Heinrich – FBH
8. “100nm to 40nm GaN-on-Si for mm-Wave Application” Remy Leblanc – OMMIC
9. “InGaAs mHEMTs: Technology and Circuit Aspects for mm-Wave and THz Applications” Fabian Thome – Fraunhofer IAF
10. “A Technology-Design Roadmap Addressing 300GHz Connectivity” Baudouin Martineau – CEA-LETI

Session: WS – 04
Chair/Vice-Chair: Kazutaka Inoue / Kazuya Yamamoto
Affiliation: Sumitomo Electric Industries / Mitsubishi Electric

Abstract:

Various RF front-end technologies based on GaN, Si-CMOS etc. for 5G new radios (NRs) base stations have been discussed in major conferences up to now. Now, the 3GPP has announced that 5G standards have been completed for services. This workshop introduces not fantastic but “real” 5G devices and systems accordingly while focusing on sub-6 GHz power amplifiers and 28 GHz transmitters. In addition, the workshop covers recent progress in RF devices, circuits, assembly, and phased array systems not only for 5G base stations but also for 5G handsets. These above hottest 5G NR topics will be provided by real 5G base-station manufacturers and real device suppliers.

The workshop attendees, therefore, will be able to learn and understand a variety of technical issues, their countermeasures, and the latest results related to base station transmitters and handset amplifiers of 5G NRs at a time. Thus, it is expected that this workshop will be very useful for 5G amplifier designers; beginners or less-experienced circuit/device designers as well as experienced designers engaged in circuit- and device-suppliers for use in 5G NRs.

Programme:

1. “Overview of 5G and expectations for RF front-end” Hiroshi Okazaki – NTT DOCOMO, INC
2. “GaN HEMT Power Amplifiers for 5G Base Stations” James Wong – Sumitomo Electric Europe Ltd.
3. “GaN Technology Challenges with 5G Infrastructure Applications” Monte Miller – NXP Semiconductors, USA
4. “Advances in 5G handset RF front-ends: PAs and filters” Florinel Balteanu – Skyworks Solutions Inc.
5. “Envelope tracking power amplifiers for 4G/5G mobile handset applications” Kenji Mukai – Murata Manufacturing Co., Ltd.
6. “100nm and sub 100nm GaN/Si MMIC processes : The perfect complement to mmW 5G applications” Marc Rocchi – OMMIC
7. “GaN HEMT Technologies for 5G Base Station Amplifiers” Kazutaka Inoue – Sumitomo Electric Industries, Ltd.

Session: WS-08
Chair/Vice-Chair: Gabriele Formicone / Guillaume Callet
Affiliation: Integra Technologies / UMS

Abstract:

Latest or emerging trends in radar and communications take advantage of operation over multiple frequency bands to achieve system capabilities unobtainable through operation over a standard frequency band. One example of such trend is clearly manifested in wireless communications with carrier aggregation and multi-band front-ends. Wireless communications over multiple bands enable higher data rates and these low power systems can take advantage of the latest developments in tunable and reconfigurable components. Other examples of RF systems operating over multiple bands are dual-band transponders and transceivers for satcom or telemetry, tracking and command (TT&C). Similarly, although operating at much higher power levels compared to multi-band communication systems, a radar operating over multiple bands has the capability of providing greater functionality. For example, a radar operating at S and X band (DBR, Raytheon) or C and X band (Kronos, Leonardo), or S and C band, or X and Ka band (GEMINI-DB) can provide an unprecedented level of performance and capability to detect and track hostile targets or higher resolution and more information in remote sensing applications. Such multi-band RF systems require sub-system components such as power amplifiers, antennas, filters, switches, etc. with unprecedented design challenges. This workshop focuses on RF technologies and techniques available for power amplifiers operating over multiple bands. Being a relatively new field, power amplifier design techniques are still evolving without a fully established methodology. Moreover, although multi-band communication systems operate over relatively close multiple bands, where broadband / wideband power amplifier techniques can be quite successful, multi-band radar frequency bands tend to be very far apart where traditional broadband / wideband techniques may not yield the best performance. For instance, broadband / wideband power amplifier techniques require very expensive trade-offs in terms of efficiency, gain and power level. Therefore, innovative ideas suitable for such emerging systems are strongly desired with the potential to achieve higher RF performance metrics in terms of efficiency, gain and power level. This workshop reviews the RF and MW technologies and techniques available to the designers today, with the hope of opening a debate and stimulating new ideas and maybe identifying new directions of research and development which could lead to future multi-band high power amplifiers with superior performance than achievable today.

A tentative outline of the agenda for the workshop is the following:
1) Introduction: Multi-Band Communications and Radar Systems Requirements and Considerations
2) Review of Solid-State RF & MW technologies and Travelling Wave Tubes for Multi-Band RF PAs
3) Review of Broadband / Wideband Design Techniques for Multiband Communication and Radar Systems
4) Power Amplifier Architecture implementation: MMIC and / or multi-chip planar / hybrid module
5) Review of other components (switches, antennas, etc.) for Multi-Band RF Systems
6) Conclusions and discussions

Programme:

1. “X-band Compact Dual-Polarimetric Doppler Radar using GaN Power Amplifier Module” Takuo Kashiwa – Furuno Electric Co.
2. “High-power solid-state amplifier modules for Multi-Band coherent radar systems” Giorgio Pizziol – GEM Elettronica
3. “Microwave developments for new Airborne Antennas” Yves Mancuso – Thales DMS
4. “Advanced AESA architectures based on new GaN Solutions” Claudio Lanzieri – Leonardo Company
5. “Technologies and architectures for space-borne highefficiency RF power amplifiers” Václav Valenta – ¹European Space Agency (ESA)
6. “GaN Technologies for Multi-band/Broadband Power Amplifiers” Rüdiger Quay – IAF-Fraunhofer: Fraunhofer Institute for Applied Solid-State Physics
7. “High Power RF Pallet Solutions for Radar Systems from UHF to S-band” Gabriele Formicone – Integra Technologies, Inc.
8. “High efficiency Wideband Power amplifier using Envelop tracking technology for high data rate communication application” Wilfried Demenitroux, Stéphane Dellier – Thales Group, Wupatec
9. “Multi-band High-Efficiency Power Amplifiers for Concurrent Signal Transmission” Zoya Popovic – University of Colorado, Boulder, Colorado

Agenda

1. “Design Considerations for 5G mm-Wave Transmitters and Power Amplifiers” Stefan Andersson, Sven Mattisson, Fredrik Tillman – Ericsson – Abstract
2. “mm-Wave InP Power Amplifier for High Speed Wireless Communications” Hiroshi Hamada – NTT – Abstract
3. “mm-Wave GaN MMIC PA Design for High Efficiency and High Power” Zoya Popović – University of Colorado Boulder – Abstract
4. “PA Design in Silicon (SiGe & CMOS) and Other III-V Processes for Advanced Beamformed Applications” Eric Kerhervé, Vincent Knopik –  IMS (UMR 5218) Abstract
5. “Wideband GaN-Based Supply-Modulated Power Amplifier Systems” Olof Bengtsson, Sophie Paul, Sebastian Preis, Nikolai Wolff – FBH – Abstract
6. “Transmitter Architectures for PA Efficiency” Earl McCune – EMC2 – Abstract
7. “5G High Power RF Front-End Solution for Ka-Band” Mohammed Ayad, Laurent Marechal – UMS – Abstract
8. “Process Technology Benchmarking for mm-Wave PA” Didier Belot – CEA-LETI – Abstract

Over the past decades, the RF/microwave community has expanded and benefited from the rapid development of the semiconductor industry. Advances in exploratory materials and structures have enabled devices switching at higher frequency, while keeping a compact form factor and increasing energy efficiency. These devices are now reaching the level of industrial maturity to meet the requirements for 5G power applications at mm-wave frequencies and beyond. In this one-day workshop, nine invited talks from semiconductor experts, academic researchers and the global end-users will be presented. The workshop will cover all key aspects of advanced technologies for 5G, including 1) mm-wave GaN devices and integration, 2) ultra broadband RF SoC, 3) integration for RF transceivers, and 4) wafer-level packaging for high frequency devices. It will give the attendees a comprehensive exposure to the latest 5G technological solutions and breakthrough.

Agenda: