Special Issue on Emerging Materials and Processing Technologies for RF/microwave Applications and Wireless Systems

IEEE Transactions on Microwave Theory and Techniques
Special Issue on
Emerging Materials and Processing Technologies for RF/microwave Applications and Wireless Systems

Submission Deadline: September 30, 2024

 

Motivation:

Novel materials, processes and manufacturing technologies have emerged in recent years, which have shown great potential in the development of RF/microwave and wireless systems and applications. Over the last 20 years, there has been a growing interest in RF/microwave materials and fabrication techniques, which enable the creation and innovation of devices, microwave circuits and systems over MHz-through-THz. This Special Issue on Emerging Materials and Processing Technologies for RF/Microwave and Wireless Systems and Applications is to promote this area by providing excellent opportunities for cross-disciplinary researchers and practitioners to share the recent progress on microwave materials and fabrication techniques.

The scope of this T-MTT Special Issue includes emerging RF/microwave materials and fabrication processes, which should present significant potential in advancing future RF, microwave, millimeter-wave, terahertz devices, circuits, and systems. This cross-disciplinary area brings together researchers, scientists, and engineers of different backgrounds to promote and exploit emerging and novel materials, processes, and manufacturing techniques. This also provides opportunities for the MTT-S community to share cross-disciplinary R&D activities and outcomes. Publishable manuscripts may include but not be limited to material engineering, chemical engineering, photonics/optical engineering, mechanical engineering and process engineering.

Proposed Field of Interest:

  1. Additive Manufactured (3D printed) Microwave Components and Systems:
  • Additive Manufacturing techniques for RF device fabrications, such as fused deposition modelling (FDM), continuous liquid interface production (CLIP), and selective laser sintering (SLS).
  • Dielectrics materials for RF circuit designs: Low-loss materials, high dielectric constant materials, phase-changing materials.
  • Metallic materials for RF circuit designs: steel, silver, copper, and alloy.
  • Multimaterial 3D printing, e.g. dielectric and conductive materials.
  • Bioprinting in microwave applications
  1. Emerging Fabrication and Processing Techniques for Microwave Applications:
  • Subtractive processing: precision CNC for prototyping microwave devices
  • Hybrid manufacturing for RF applications: additive and subtractive hybrid processing
  • Materials coating techniques for RF components
  • Multimaterails fabrication for microwave circuits
  • Nano/micro processing techniques for RF/microwave devices and circuits
  • Heterogeneous integration and processing techniques
  1. Functional RF Materials for Microwave Circuits and Systems:
  • Shape-memory materials for RF designs: Shape-memory alloy and shape-memory polymer
  • Electromagnetic absorbing materials/magnetic materials
  • Phase-tunable materials
  • Magnetic materials and multiferroics
  • RF materials formulation
  • Tunable RF materials stimulation/modeling techniques
  • Material training/stimuli strategies: Electrical, heat, light, magnetic waves
  • Next generation of semiconductors, including emerging wideband gap and oxide materials
  • Characterization of materials for microwave applications

Guest Editors:

A/Prof. Yang Yang
yang.yang-1@uts.edu.au
University of Technology Sydney, Australia

Prof. Ke Wu,
ke.wu@polymtl.ca
Polytechnique Montréal, Canada

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