Zheng Liu

Zheng Liu received the B.S. degree from Peking University, Beijing, China, and the M.S. degree from UCLA, Los Angeles, CA, USA. He received the Ph.D. degree from Princeton University, Princeton, NJ, USA.

He was a Senior RFIC Designer at Skyworks Solutions, where he developed high-volume RF power amplifiers and front-end modules for advanced handset applications. He subsequently collaborated with Apple on millimeter-wave beamforming ICs. From 2023 to 2025, he was a Researcher at Texas Instruments’ Kilby Labs, where he served as a key designer of GaN-on-Si power-amplifier modules for FR3 wireless infrastructure. He is currently an Assistant Professor in the Department of Electrical and Computer Engineering at the University of Wisconsin-Madison.

His research interests include RF and millimeter-wave integrated circuits and systems, broadband phased arrays, high-efficiency power amplifiers, and AI-enabled RFIC and electromagnetic design. Dr. Liu received the 2023 Princeton University Bede Liu Best Ph.D. Dissertation Award and the IEEE 2023 Journal of Solid-State Circuits Best Paper Award. His work also received the 2022 IEEE IMS Advanced Practice Paper Award and three IEEE IMS Best Student Paper Awards. His other honors include the 2022 IEEE MTT-S Graduate Fellowship and the 2021 Analog Devices Outstanding Student Designer Award. He is an Affiliate Member of the IEEE MTT-S Technical Committee on Microwave and Millimeter-Wave Integrated Circuits (TC-14) and serves on the Technical Program Review Committee for the IEEE International Microwave Symposium and the Technical Program Committee for the IEEE/ACM International Conference on Computer-Aided Design.