Renyuan(Ryan) Wang

Renyuan(Ryan) Wang received the Ph.D. degree in electrical engineering from Cornell University, Ithaca, NY, USA, in 2015. His graduate research focused on RF MEMS and RF photonic device technologies based on ferroelectric and III-V materials. From 2015 to 2017, he was a Research and Development Engineer with the BAW Advanced Process Group at Qorvo, Apopka, FL, USA.

From 2017 to 2024, he was with BAE Systems FAST Labs, Nashua, NH, where he served as a Technology Development Director. In this role, he led research under multiple DARPA programs, including COFFEE, HOTS, and WARP, to develop RF/microwave technologies leveraging ferroelectric and ferro/ferrimagnetic materials and their intercouplings. Since 2024, he has been a Director of Engineering at MACOM Technology Solutions, Inc., leading the development of next-generation RF/microwave device technologies.

Dr. Wang is a member of the IEEE Microwave Theory and Technology Society (MTT-S) and the IEEE MTT-13 Technical Committee on Microwave Control Materials. He has served on the Technical Program Committee (TPC) of the IEEE RFIC Symposium since 2019 and is a regular reviewer for several IEEE and Springer Nature journals.