Dieff Vital

Dieff Vital (Graduate Student Member, IEEE) was born in Torbeck, Haiti. He received the B.Sc. degree (summa cum laude) in mechanical and industrial engineering from the Florida Polytechnic University (Florida Poly), Lakeland, FL, USA, in 2017. He completed the Ph.D. degree in electrical and computer engineering at Florida International University (FIU), Miami, FL, USA, in 2021. From 2016 to 2017, he was a Research Assistant with Florida Poly, where he developed supercapacitors out of phosphatic clay mixed with diatoms. His current research interests include RF systems on-textile, wireless power transfer, and harvesting for Internet of Things applications and smart dressing solutions for electrochemical sensing and monitoring. Dr. Vital received the Florida Academy of Sciences Al Hall Memorial Award for Best Poster and Excellent Academic Achievement for this work. He was a recipient of the McKnight Dissertation Fellowship, the FIU Fall 2018 Student Conference Award, the International Microwave Symposium (IMS2019)/RFIC2019 Ph.D. Student Sponsorship (travel award),the 2019 U.S. National Committee for the International Union of Radio Science (USNC-URSI) Travel Fellowship, the National Science Foundation(NSF) student travel to attend the smart health workshop, the NSF IEEERFIC’20 Student Conference Registration Award, and the McKnight Fellow-ship Travel Grant. He has also received the Third Place from the IMS2019 Stu-dent Design Competition and honorable mentions in IMS2019 and IMS20203MT Competitions. In addition, he received the 2021 Young Scientist Award from the IEEE URSI-GASS. Starting August 2021, he will be a Bridge-to-the-Faculty Postdoctoral Associate at the Electrical and Computer Department of the University of Illinois at Chicago where he will continue his work on textile-based RF modules, wireless and smart sensing for medical applications.