![TC-9 Activities at IMS/RFIC 2024](https://mtt.org/app/uploads/2024/05/washington_logo_1750x1740-560x557.jpg)
TC-9 Activities at IMS/RFIC 2024
Workshop on June 16th, 2024 WSF: 3D Heterogeneous Integration and 3D-Packaging Targeting B5G-6G mmW and Sub-THz Communication and Sensing Organizers: Didier Belot (STMicroelectronic) / Pierre Busson (STMicroelectronic) The 6G Telecom generation forecasts mm-wave and sub-THz applications as Fronthaul and Backhaul mm-wave and sub-THz wireless links; Reflective Intelligent Surface between mini-cell station and devices mainly in […]