DOI: 10.1109/TMTT.2025.3624010   IEEEXplore: https://ieeexplore.ieee.org/document/11219005    

Substrate-less rigid waveguide structure for transition from rectangular waveguides to monolithic microwave integrated circuits (MMICs)

W-band (75–110 GHz)

A trapezoidal metal probe, acting as a TE-to-quasi-TEM mode converter, interfaces with the chip through standard gold wire bonding.

MMIC integration with filters, couplers, power dividers and antennas.

< 0.86 dB measured insertion loss and >15.0 dB return loss (75–110 GHz) for prototype-I to a quartz-substrate microstrip line segment; 0.5 dBm output power variation (96–104 GHz) for prototype-II compared to datasheet specifications to a commercial PA MMIC.