DOI: 10.1109/TMTT.2025.3644326   IEEEXplore: https://ieeexplore.ieee.org/document/11319244

Dual-signal air-filled transmission line (DS-AFTL) for high-speed interchip connections.

DC – THz

The transmission line is fabricated using low-cost printed circuit board (PCB) technology and is constructed based on a three-layer stacked substrate. Two thick copper layers form enclosed air cavities that fully encapsulate the two parallel signal lines, which significantly reduces dielectric loss. The dual-signal lines are interconnected via a row of metallic vias. These vias equalize the current distribution and minimize conductive loss, thereby lowering the overall transmission loss. The DS-AFTL achieves a 59% insertion loss reduction compared to a conventional coplanar waveguide.

High-speed short-distance chip-to-chip interconnections in advanced packaging applications.

0.132 dB/mm insertion loss at 110 GHz, reflection coefficient below−10 dB from dc to 110 GHz.