140-GHz 2-D Scalable On-Grid 8⨉ 8-Element Transmit–Receive Phased Arrays With Up/Down Converters Demonstrating a 5.2-m Link at 16 Gbps

140-GHz 2-D Scalable On-Grid 8⨉ 8-Element Transmit–Receive Phased Arrays With Up/Down Converters Demonstrating a 5.2-m Link at 16 Gbps

Abstract
DOI: 10.1109/TMTT.2023.3346407   IEEEXplore: https://ieeexplore.ieee.org/document/10385187
Device
Wafer-scale 8x8 element transmit-receive (TRX) phased array in 45nm RFSOI CMOS with RF beam forming with 4-bit phase and gain controls.
Spectrum
140 GHz (D-band)
Novelty
Low cost silicon and low cost packaging close to 0.5λ wide for a high performance, scalable, D-band phased array capable of 60° H-plane scanning. On-chip up/down converter (UDC) between the PCB IF and the on-chip distribution network (DN) occupies one element of the array.
Application
High data rate, low latency, D-band 6G phased array wireless links.
Performance
±60° H-plane and ±38° E-plane scanning for both TX and RX; 34-37.5 dBm TX EIRP, 137.5 -145 GHz; -12 to -9 dBm P1dB, 134-143 GHz; < 7% / < 6% rms EVM using 16 QAM / 64 QAM up to 24 Gb/s data rates; 1.45 m link at 20 Gb/s data rate, 5.2m link at 16 Gb/s using 16 QAM; 170 mW/element TX, 105 mW/element RX power consumption.