IMS 2023 SDC9: mmWave 3D-printed Antenna Design Come to IMS 2023 in San Diego and participate in our Student Design Competition! You can test your mmWave 3D printing antenna design skills and win prize money. Review the description of the competition and rules here. To participate, register at https://ims-ieee.org/2023SDC The student design competitions will take […]
IMS 2023 WSO: Advanced Wafer-Level Heterogeneous Integration and Packaging for mm-Wave 5G and 6G Applications Organizers: Kamal Samanta, Kevin Xiaoxiong Gu Organizer organizations: Sony, Metawave Date: June 11th 2023 Location: San Diego Convention Center Room 32AB This workshop will cover various recently developed technologies and the state-of-the-art performance in wafer-level integration and packaging technologies and manufacturing techniques […]
Keynote Talks EuMW Week, EuMC2021, 2-7 April 2022, London: K K Samanta, ‘Advanced Integration and Packaging of High-Power Components and Amplifiers for 5G/Beyond Industrial Applications”. Workshops IEEE IMS 2022: Front-end module integration and packaging for 6G and beyond 100GHz communication and radar systems. Workshop Chair/organizer: Kevin Gu & Kamal K Samanta Publications Guest Edited The […]
Keynote Talk IEEE, MTT-S, EuMW2020 Week, 10-15 Jan,2021 Netherlands: ‘Advanced Multilayer Components and Front-End Modules for Millimetre-Wave and 5G Applications’. By Kamal K Samanta Workshop IEEE IMS 2021: Advanced Multichip Modules and Packaging for 5G and Beyond Invited Talks Special session Talk, IEEE, MTTs RFIT2021, Taiwan: High Power Wide-Band GaN Amplifiers: Industrial Design and Challenges. […]
Keynote Talks IEEE, MTT-S, EuMW2020, Netherlands: ‘Advanced Multilayer Components and Front-End Modules for Millimetre-Wave and 5G Applications’. Kamal K Samanta Invited Talks Invited Special Talk: IEEE Electronics Systems- Integration Technology Conference (ESTC 2020), Norway, (representing IEEE RF-AMS Working Group) on Heterogeneous Integration Roadmap: 5G Communications. By Kamal K Samanta
Keynote Talks EuMW 2019, Paris, France: on Wideband GaN PA Design and integration: industrial Challenges and Techniques. Delivered by Kamal K Samanta Workshops Organized & Speaker: IMS2019 (with TC-14): Recent Advancement and Trends in 3D heterogeneous integration for mmW 5G and Terahertz. By Kamal K Samanta Organized IMS2019 (with TC12): Advanced Packaging Technologies for High-Performance […]
Publications Guest Edited Focused Issue for IEEE Microwave Magazine (with TC-14): K. K. Samanta and D. Kissinger, “Multilayer Millimeter-Wave MCMs [From the Guest Editors’ Desk],” in IEEE Microwave Magazine, vol. 19, no. 1, pp. 20-135, Jan.-Feb. 2018 Invited Paper: K. K. Samanta, “Ceramics for the Future: Advanced Millimeter-Wave Multilayer Multichip Module Integration and Packaging,” in […]
Publications Guest Edited Focused Issue for IEEE Microwave Magazine (with TC-14): K. K. Samanta and D. Kissinger, “Heterogeneous Integration [From the Guest Editors’ Desk],” in IEEE Microwave Magazine, vol. 18, no. 2, pp. 14-16, March-April 2017 Invited Paper: K. K. Samanta, “Pushing the Envelope for Heterogeneity: Multilayer and 3-D Heterogeneous Integrations for Next Generation Millimeter- […]
