Maciej Wojnowski received the M.Sc. degree (cum laude) in microwave engineering from the Technical University of Gdańsk, Gdańsk, Poland, and the Ph.D. degree (summa cum laude) from the University of Erlangen-Nuremberg, Erlangen, Germany, in 2004 and 2011, respectively.
He has been with Infineon Technologies AG, Munich, Germany, since 2005. He has been working in development of RF and millimeter-wave passives and antennas for system-in-package applications. He was responsible for electrical characterization of the embedded Wafer Level Ball Grid Array (eWLB) technology. He is currently the Principal Engineer and the Head of Electromagnetic Simulation and Characterization in the central development department at Infineon Technologies AG. He is the author or co-author of more than 50 papers and holds numerous patents in the areas of RF and millimeter-wave packaging and passive device characterization. His research interests include package characterization and modeling, antenna and passive device integration for system-in-package, calibration and de-embedding techniques, and computational electromagnetics.
Dr. Wojnowski is co-recipient of the 2007 Outstanding Paper Award of the 9th Electronics Packaging Technology Conference (EPTC 2007) and of the 2012 Outstanding Paper Award of the 62th Electronic Components and Technology Conference (ECTC 2012). In 2018, he received the IEEE MTT-S 2018 Outstanding Young Engineer Award “For Leadership and Contributions to the Fields of Millimeter-Wave Packaging and Passive Device Characterization”.