Kamal K Samanta (M’03–SM’08) graduated in Science (Phy), and Engineering (ECE) before his double master’s in Management (R&D), and Technology (mmW), which followed his PhD degree in Microwave Eng. from the University of Leeds, UK. He has got extensive experience of about 25 years and led multidisciplinary industrial research and technology/product development activities for a wide range of industries, including satellite/space, defence/security, atomic reactor/green energy, high power, semiconductor, and wireless comm.; covering frequency MHz to THz and power from μW (MMICs) to Megawatts (SSPAs). Developed products (space-qualified and commercial) includes advanced multilayer/3D components (with antennas/filters), devices, circuits (GaN/GaAs/Si, MMICs/MCM) and systems. His roles have included that of Chief/Senior Principal/Lead R&D -Engineer, -Scientist and -Consultant. The organizations he has worked for include Thales Aerospace, UK (Radar, EW and ESM systems); European Aeronautics Defence and Space(EADS) Astrium (Airbus), UK, (GaN, HPA, Satellite Comm); Indian Space Research Organization, ISRO, (satellite payload ckts, Tx/Rx); IPR, Dept. of Atomic Energy (2MW, 64 active phased array system), Milmega (GaN SSPAs), and RFMD and Filtronics Comp Semiconductor (MF MMICs: pt-to-pt radios, PAs). Presently, he is working for Sony Europe B V, UK as the Chief Technologist- microwave and mmW, next-generation front-end modules (5G/beyond). His current interest includes multidisciplinary and multiphysics research and development of novel active/passive devices, multilayer/3D miniaturized components, circuits (GaAs/SiGe/GaN/InP, PAs), and cost-effective multichip and system-on-package (SoP) modules, and leading industrial solutions. In these areas, he has published >75 peer-reviewed papers (first/sole authored) and have delivered >45 invited talks (incl. keynotes/panels) in IEEE MTTS conferences.
Dr. Samanta was the recipient of the Commonwealth Fellowship, the best International Researcher Award, and the Engineering Excellence Award from the IET, London, (2004/5). He is a fellow of IET and life fellow of IETE, Chair/member of IEEE MTT-S Tech Committees – TC-12 (integration/packaging), TC-5 (PA), TC-6 (MMIC/MCM) and TC-8 (filters/passives). He sits on the TPC of the major IEEE MTTS conferences, and Guest Editor for the Special Issues of the IEEE Microwave Journal/Magazine on 3D Heterogeneous Integration, mmW MCMs, and packaging. He has served as an Associate Editor (AE) for IEEE MWCL (2013-18) and has been serving as an AE for the IEEE Microwave Magazine, and IEEE Trans Microwave Theory and Techniques.