Hung-Wei Wu

Hung-Wei Wu

Status

  • 2016, Outstanding Young Engineer Award, Past Awardees**
  • Associate Editor, Transactions Editors, MTT Transactions, Publications**
  • Member, TC-28 BIOLOGICAL EFFECTS AND MEDICAL APPLICATIONS, Technical Committees**
Contact
Feng Chia University
Taiwan

Biography

Hung-Wei Wu was born in Taipei, Taiwan, in 1978, and the Ph.D. degree from the Institute of Microelectronics, National Cheng Kung University, Taiwan, in 2007. From 2009 to 2020, he was with the Kun Shan University, Tainan, Taiwan, Dean of Creative Media, Director of the Innovation Startup and Incubation Center, and Full Professor of the Department of Computer and Communication. Since 2021, he has been with Feng Chia University, Taichung, Taiwan. His research interests include microwave filter design, Low-K material for mm-wave applications, optoelectronics semiconductor thin films engineering, bioelectronics for rare cell screening, and mm-wave biosensors for identifying cancer cells.

Dr. Wu is a Senior Member of IEEE and Member of the European Microwave Association (EuMA), the Institution of Engineering and Technology (IET), the IEEE MTT-S Technical Committee Member in MTT-28, the associate editor of IEEE Transactions on Microwave Theory and Techniques. He also serves on the Technical Program Committee, the Organizing Chair of workshops of the IEEE Bio-Wireless Conference, the Technical Paper Review Committee Member of the IEEE MTT-S International Microwave Symposium, and Associate Editor of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society. Furthermore, he has also served as an Associate Editor for the International Journal of Microwave and Wireless Technologie, the Nano-Biomedicine Technical Committee Member in the IEEE Nanotechnology Council (NTC), IEEE EMB-S Technical Committee Co-Chair on Bionanotechnology and BioMEMS, and the IEEE Region-10 Conference and Technical Seminar Committee. In addition, he has served as an invited speaker at many IEEE-related conferences, such as IEEE MTT-S IMS, IEEE MTT-S EuMC, IEEE MTT-S APMC, IEEE MTT-S RWS, IEEE MTT-S APCAP…etc.

He was the recipient of the National Innovation Award in 2014, 2015, 2018, 2019, and 2020, and 2019 MERCK Award of Honor, the 2019 Outstanding Teaching Award by Kun Shan University, the 2018 National Innovation Award, the 2017 Outstanding Electrical Engineering Professor Award twice, 2017 National Industrial Innovation Award, the Innovation Award in 2016 TECO International Green Tech Contest, 2016 IEEE MTT-S Outstanding Young Engineer Award. In addition, he was the recipient of the 2015 and 2014 National Innovation Award, the Outstanding Young Electrical Engineer Award and Outstanding Electrical Engineer Award in 2014, the IEEE Tainan Section Best Gold Member Award, the Outstanding Youth Award of TAIWAN Electronics Devices and Materials Association, and the Silver Medal Award of the Exhibition of Inventions Geneva, Switzerland, in 2013. He also received the Gold Medal Award of the Taipei International Invention Competition and the Outstanding Research Academic Reward of Universities by the Ministry of Science and Technology in 2012.

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