Harshpreet Bakshi

Harshpreet Bakshi

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Status

  • Member, TC-16 MICROWAVE AND MILLIMETER-WAVE PACKAGING, INTERCONNECT AND INTEGRATION, Technical Committees**

Biography

Harshpreet Bakshi is a Senior Member of the IEEE and holds an M.S. and Ph.D. in Electrical Engineering. Between 2015 and 2022, he worked at Idea Cellular Ltd., CommScope Inc., Apple Inc. and at the Texas Analog Center of Excellence in various Antenna and RF hardware design roles. Since 2022, he has been with the Semiconductor Packaging Platform Technology  R&D organization at Texas Instruments Inc. His research interests include mmWave and THz antenna design, semiconductor packaging, and RF system design. He serves as a reviewer and session chair of several journals and conferences of different IEEE societies including the AP-S, MTT-S and EP-S and is invited regularly to deliver technical presentations and workshops. In 2024, he was elected to the Technical Program Committee of IEEE RFIC Symposium and the MTT TC-16.

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