Chiara Mariotti received her M.S. and Ph.D. degrees in Electrical and Telecommunication Engineering from the University of Perugia (Italy) in November 2011 and February 2016, respectively. She has experience in passive RF components design, additive manufacturing process development (in particular inkjet printing), physical and electrical characterization of materials, flexible electronics, Internet of Things (IoT) and packaging solutions for MEMS-based sensors.
She has co-authored more than 40 peer-reviewed papers and 2 book chapters with more than 600 citations in scholar. She has been a visiting Ph.D. student at Georgia Institute of Technology, GIT, (Atlanta, GA, USA) for more than one year and at the Institute of Telecommunications (IT) of the University of Aveiro (Portugal) for two months making experience with additive manufacturing for wireless applications. She attended several IEEE sponsored conferences as speaker and she gave lectures at GIT and University of Perugia. She is IEEE member since 2012, she is part of the MTT-TC-8 since June 2019 and she is reviewer for IEEE journals and conferences, Cambridge University Press and Elsevier journals.
In February 2016 she joined Infineon Technologies Austria AG as R&D expert engineer contributing to the development of a new hybrid platform at THz frequencies for Telecommunication and/or sensing applications in the European funded project M3TERA (H2020). In November 2017 she joined the 5G team of Infineon Austria to develop solutions for the integration of passive components in novel telecommunication modules. Currently, she is senior concept engineer at Infineon Technologies in Munich (Germany) working on innovative packaging solutions for sensors.