IEEE Microwave Magazine – August 2022
The August issue of the IEEE Microwave Magazine is out! This issue features packaging and beyond with articles on interconnects and passive components. We also have a great set of columns for you. For the real overview of this issue check out the Editor’s Desk column. And for all the background on the features check out the Guest Editor’s Desk .
Our features start with cost effective packaging and interconnects to 180 GHz. Another feature follows the 3D printing trend by discussing additive packages with everything from BGA attachment to embedded ICs and even antennas. Interconnects within the package and to external devices get more difficult and more important as the frequency increases. One of our features covers interconnects in detail with an emphasis on graphene. And out metaconductor feature covers passive components with magnetic and non-magnetic conductors.