IN THIS ISSUE
- From the Editor
- Table of Contents for recent MTT publications
- IEEE Compound Semiconductor IC Symposium (CSICS 2014)
- Top Three Reasons Members Join IEEE Societies
- Call for Nominations for Election to the MTT-S Administrative Committee
- Call for Nominations: IEEE Fellows
- A Little Humor
- IEEE-USA Launches New Salary Service
- How IEEE Spectrum Was Born
- Upcoming Deadlines
- Upcoming Conferences
Thought of the Month:
“The greatest enemy of knowledge is not ignorance, it is the illusion of knowledge.” – Stephen Hawking
From the Editor
Welcome to the January 2014 issue of the IEEE MTT-S e-newsletter; the official monthly e-newsletter for MTT-S members. We have a great year ahead of us with many conferences, workshops, and events coming up. We kick off the year with the IEEE Radio and Wireless Week in Newport Beach. Hope to see you there!
I would like to wish everyone a very Happy New Year!
— Bhaskar Banerjee
Editor, MTT-S eNewsletter
Table of Contents for recent MTT publications
IEEE Compound Semiconductor IC Symposium (CSICS 2014)
CSICS 2014 will be held on October 19–22 in San Diego, CA. If you have original work in RF/microwave, millimeter-wave, THz, or high-speed analog mixed-signal circuit design, CSICS is one of the preeminent international forums at which to present it. While the symposium maintains its traditional focus on III-Vs with an excellent blend of papers on GaN, GaAs, and InP, it also features “state-of-the-art” device and circuit results in the areas of SiGe, nano-scale CMOS, and GaN PA thermal management. Specific areas of interest include:
- Power amplifier devices and circuits such as Doherty, Envelope-Tracking, GaN HPAs, Class-D/E/F PAs
- Power amplifier linearization, combining techniques, packaging and thermal management
- Low Noise Amplifiers
- Frequency generation and conversion including VCOs, mixers, modulators, multipliers and dividers
- Passive circuit elements such as phase shifters, couplers, dividers, combiners, and hybrids
- Millimeter-wave/THz transmitters and receivers and sub-components
- Device and circuit modeling concepts, implementation, EM and EDA tools
- System applications such as wireless handsets, base-stations, point to point/multipoint, sensors, RADAR, and SATCOM
- High performance GaN, InP, CMOS and SiGe devices
High quality technical papers will be selected from worldwide submissions for oral presentation and publication in the Symposium Digest. Extended versions of selected papers from the Symposium will be published in a special issue of the IEEE Journal of Solid State Circuits.
Paper Submission Deadline: 2 May 2014
Paper Acceptance Notification: 13 June 2014
Final Paper Submission for Digest Publication: 25 July 2014
For the full call for papers, paper submission details, registration, and up-to-date information please visit the CSICS website. Further questions may be addressed to the Technical Program Chair: Charles Campbell, Ph: +1–972–994–3644.
Top Three Reasons Members Join IEEE Societies
The main reasons members join technical societies is to keep technically current with an increased interest in professional development activities, according to results from a recent IEEE survey (IEEE Account required). The findings identify three key motivators for belonging to a society:
- Being in the Know: Access to technical content remains the number one reason members join societies, with over two-thirds citing it as their main motivator. Keeping technically current has only become increasingly important over the last four years: a three point increase for higher grade and eight point increase for students.
- Networking for Advancement: Desire to network with colleagues has increased in importance by 12 points. With opportunities to attend local chapter activities (up 11 points) and other events, members perceive society membership as an essential way to interact with like-minded professionals.
- Increasing Opportunities through Continuing Education: Facing a tougher and ever-changing job market, members view opportunities in continuing education, like online webinars and tutorials, as major motivators for joining a society.
Call for Nominations for Election to the MTT-S Administrative Committee
The IEEE MTT-S Nominations and Appointments (N&A) Committee is soliciting nominations for the candidates to the AdCom.
Nomination Procedure: Nomination may be made by sending the name of a candidate to the AdCom Nominations and Appointments Committee at email@example.com. Detailed rules for nomination procedure can be found here.
Requirements: Members submitting names should first obtain the consent of the candidate; serving on the AdCom is a major commitment of time and energy. Submissions to the N&A Committee should include:
- Candidate’s full name, full contact info, and a brief draft (less than 300 words) of qualifications, society service, and motivation.
- The candidate’s preference to be placed on the at-large ballot, or the AdCom member voted ballot (one cannot be on both ballots).
- Nominator’s name and contact information (including email address).
Submit the nomination before the deadline of April 30, 2014.
Call for Nominations: IEEE Fellows
Nominations for the Fellow Class of 2015 are now being accepted. To learn more about the Fellow program and the application process, visit the IEEE Fellow Program page. The deadline to submit nominations for IEEE Fellows is 1 March 2014.
A Little Humor
Want to hear a joke about neutrinos?
It’d probably go straight through you!
Why did the chicken cross the Moebius strip?
To get to the same side.
IEEE-USA Launches New Salary Service
IEEE-USA has launched a new and enhanced salary service featuring several new products. Users will now have a choice of two calculators – one that employs the regression model, and a new calculator that allows you to select individual filters to calculate your compensation directly from the salary survey’s raw data. IEEE-USA has also released five downloadable industry-specific salary reports along with the 2013 IEEE-USA Salary & Benefits Report.
How IEEE Spectrum Was Born
Fifty years ago was published the first issue of the IEEE Spectrum. This article in the current issue of the Spectrum presents the story of how it all began:
“The people who established Spectrum could scarcely have imagined the multimedia operation that their print magazine would evolve into. But it’s a testament to their vision that the magazine they brought into the world would go on to reap hundreds of editorial honors and awards in the United States, including five National Magazine Awards and three Grand Neal Awards. No other association magazine can claim such a trove.”
- 16–21 Jun 2014 – 6th International Conference Microwave and Radar Week – Lviv (Ukraine) Paper or Abstract Submission Deadline: 15 Feb 2014
- 1–3 Sep 2014 – IEEE International Conference on UltraWideBand – Paris (France) Paper or Abstract Submission Deadline: 11 Mar 2014
- 19–23 Jan 2014 – IEEE MTT-S Radio and Wireless Symposium – Newport Beach, CA (US)
- 19–23 Jan 2014 – IEEE Topical Conference on Biomedical Wireless Technologies, Networks, and Sensing Systems – Newport Beach, CA (US)
- 19–23 Jan 2014 – IEEE Topical Conference on Power Amplifiers for Wireless and Radio – Newport Beach, CA (US)
- 19–23 Jan 2014 – IEEE Topical Conference on Wireless Sensors and Sensor Networks – Newport Beach, CA (US)
- 19–23 Jan 23 2014 – Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems – Newport Beach, CA (US)
- 23–27 Mar 2014 – IEEE MTT-S International Wireless Symposium – Xi’an (China)
- 2–4 Apr 2014 – Workshop on Integrated Nonlinear Microwave and Millimetre-Wave Circuits – Leuven (Belgium)
- 1–3 Jun 2014 – IEEE Radio Frequency Integrated Circuits Symposium – Tampa Bay, Florida
- 1–6 Jun 2014 – International Microwave Symposium – Tampa Bay, Florida
- 16–21 Jun 2014 – 6th International Conference Microwave and Radar Week – Lviv (Ukraine)