Print-on-Demand 3D Printed Radio Frequency Components for Sustainable Electronics

Dr. Yang Yang
Associate Professor
University of Technology Sydney, Australia

Abstract: Advancements in additive manufacturing have drawn significant attention to 3D-printed electronics. As a cutting-edge prototyping solution, 3D-printed radio frequency (RF) components offer key benefits such as rapid prototyping, low entry costs, in-house short-run production, and reduced waste. This technology represents the future of electronics with print-on-demand capabilities, which minimize environmental impact and conserve resources. In this webinar, we will delve into the design and production of 3D-printed microwave radio frequency electronics, aiming to develop a new generation of high-performance RF components. The proposed 3D-printed circuits, antennas, and metasurfaces can be seamlessly integrated into wireless communication and sensing systems. Sustainable electronics are a crucial step towards reducing the environmental impact of the tech industry, promoting responsible consumption, and driving innovation in eco-friendly practices.

Speaker’s Bio: Yang Yang (IEEE Senior Member) was born in Bayan Nur, Inner Mongolia, China and received the PhD degree from Monash University, Melbourne, Australia, in 2013.

Dr. Yang served as a GSP Engineer at Rain Bird Australia from July 2012 to April 2015. In December 2016, he joined the University of Technology Sydney (UTS), where he currently holds the position of Associate Professor and leads the 3D Millimetre-Wave and Terahertz Circuits and Antennas group at UTS Tech Lab. His research focuses on intelligent radio frequency (RF) materials and additive manufacturing techniques for developing 3D millimetre-wave and terahertz devices, radio frequency integrated circuits (RFICs), and metasurfaces, with applications in 5G/6G wireless communications, CubeSat technologies, and biomedical engineering.

Dr. Yang has been recognised in Stanford/Elsevier’s Top 2% Scientist Rankings for five consecutive years, from 2019 to 2023. He has over 260 international publications in microwave, millimetre-wave and terahertz circuits and antennas. He is a current Associate Editor of IEEE Transactions on Microwave Theory and Techniques, Associate Editor of IEEE Transactions on Materials for Electron Devices, Associate Editor of IEEE Microwave and Wireless Technology Letters, Guest Editor of Proceedings of the IEEE (Special Session in Additively Manufactured Electronic Components in Multi-Material 3D and 4D Printing) and Area Editor of Microwave Optical Technology Letters. He was the Associate Editor of IEEE Access (2018-2022) and a Guest Editor of IEEE Antennas and Wireless Propagation Letters (2022). He is the current Chair of the IEEE NSW AP-S/MTT-S Joint Chapter and received the 2022 Outstanding IEEE MTT-S Chapter Award and 2023 Outstanding IEEE AP-S Chapter Award. Dr. Yang is the Founder and Inaugural Chair of the IEEE MTT-S Technical Committee Microwave Materials and Processing Technologies (TC-17), Vice Chair of the IEEE MTT-S Education Committee and Vice Chair of the IEEE NSW Electron Device Society.