The WMM Workshop at IMS 2025 in San Francisco organized by Alexander Ruderer and Thomas Ussmueller brought together leading researchers and industry experts for a full-day event titled “Recent Advances in Full-Duplex Techniques for Wireless Communication and Sensing Systems.” The workshop covered the full spectrum of self-interference cancellation across propagation, analog, and digital domains, with […]
IEEE MTT-S Technical Committee 6 “RF MEMS and Microwave Acoustics” sponsored a “Switched Acoustic Filter Module” Student Design Competition at the 2025 IEEE MTT-S International Microwave Symposium. The students were challenged to design a multi-band switched filter that combined both acoustic RF filters and RF MEMS switches. The designs were required to have one antenna […]
Workshop on June 15th, 2025 WSG: RFIC Architectures, Circuits and Systems for LEO SATCOM Broadband Access for 6G NTN Organizers: Didier Belot (STMicroclectonics)/ Pierre Busson (STMicroclectonics)/ Salvatore Finocchiaro (Qorvo) In the context of 6G and beyond, the performance demands are geared towards massive parallelization. For instance, the Non-Terrestrial-Network (NTN) is an essential component of future […]
ICMMTS 2025 February 23-26, 2025 in Dubai, UAE Mobile or even miniaturized THz devices enable novel applications in areas such as imaging, counting, localizing cells in our vessels and organs by miniaturized THz receiver arrays, recording of body and indirectly even muscle movements or detecting of plant and insect interactions by miniaturized THz radars, detecting […]
Workshop on June 16th, 2024 WSF: 3D Heterogeneous Integration and 3D-Packaging Targeting B5G-6G mmW and Sub-THz Communication and Sensing Organizers: Didier Belot (STMicroelectronic) / Pierre Busson (STMicroelectronic) The 6G Telecom generation forecasts mm-wave and sub-THz applications as Fronthaul and Backhaul mm-wave and sub-THz wireless links; Reflective Intelligent Surface between mini-cell station and devices mainly in […]
GeMiC 2024 Duisburg, Germany March 11-13, 2024 in Duisburg, Germany THz focus session and invited talks
HTSHFF is a vibrant workshop where scientists, engineers, students and industrial developers gather together to discuss all aspects of high-temperature, low-temperature, conventional and unconventional superconductors in high frequency fields, from fundamentals to applications, with a special attention to superconducting devices, original measuring methods and low temperature equipment in high-frequency fields, relevance of superconductors in high […]
IMS 2023 SDC9: mmWave 3D-printed Antenna Design Come to IMS 2023 in San Diego and participate in our Student Design Competition! You can test your mmWave 3D printing antenna design skills and win prize money. Review the description of the competition and rules here. To participate, register at https://ims-ieee.org/2023SDC The student design competitions will take […]
IMS 2023 WSO: Advanced Wafer-Level Heterogeneous Integration and Packaging for mm-Wave 5G and 6G Applications Organizers: Kamal Samanta, Kevin Xiaoxiong Gu Organizer organizations: Sony, Metawave Date: June 11th 2023 Location: San Diego Convention Center Room 32AB This workshop will cover various recently developed technologies and the state-of-the-art performance in wafer-level integration and packaging technologies and manufacturing techniques […]
Workshop on June 11st, 2023 WSL: State-of-the-Art Millimeter-Wave GaN Transistor and MMIC Technologies and Future Perspective Organizers: Farid Mejdjoub (CNRS – IEMN) / Keisuke Shinohara (Teledyne Scientific & Imaging) Owing to superior electrical and thermal properties of GaN-on-SiC material systems, a tremendous progress has been made on GaN-based transistor and MMIC technologies. Advanced heterostructure material […]
Keynote Talks EuMW Week, EuMC2021, 2-7 April 2022, London: K K Samanta, ‘Advanced Integration and Packaging of High-Power Components and Amplifiers for 5G/Beyond Industrial Applications”. Workshops IEEE IMS 2022: Front-end module integration and packaging for 6G and beyond 100GHz communication and radar systems. Workshop Chair/organizer: Kevin Gu & Kamal K Samanta Publications Guest Edited The […]
Keynote Talk IEEE, MTT-S, EuMW2020 Week, 10-15 Jan,2021 Netherlands: ‘Advanced Multilayer Components and Front-End Modules for Millimetre-Wave and 5G Applications’. By Kamal K Samanta Workshop IEEE IMS 2021: Advanced Multichip Modules and Packaging for 5G and Beyond Invited Talks Special session Talk, IEEE, MTTs RFIT2021, Taiwan: High Power Wide-Band GaN Amplifiers: Industrial Design and Challenges. […]
Keynote Talks IEEE, MTT-S, EuMW2020, Netherlands: ‘Advanced Multilayer Components and Front-End Modules for Millimetre-Wave and 5G Applications’. Kamal K Samanta Invited Talks Invited Special Talk: IEEE Electronics Systems- Integration Technology Conference (ESTC 2020), Norway, (representing IEEE RF-AMS Working Group) on Heterogeneous Integration Roadmap: 5G Communications. By Kamal K Samanta
Keynote Talks EuMW 2019, Paris, France: on Wideband GaN PA Design and integration: industrial Challenges and Techniques. Delivered by Kamal K Samanta Workshops Organized & Speaker: IMS2019 (with TC-14): Recent Advancement and Trends in 3D heterogeneous integration for mmW 5G and Terahertz. By Kamal K Samanta Organized IMS2019 (with TC12): Advanced Packaging Technologies for High-Performance […]
Publications Guest Edited Focused Issue for IEEE Microwave Magazine (with TC-14): K. K. Samanta and D. Kissinger, “Multilayer Millimeter-Wave MCMs [From the Guest Editors’ Desk],” in IEEE Microwave Magazine, vol. 19, no. 1, pp. 20-135, Jan.-Feb. 2018 Invited Paper: K. K. Samanta, “Ceramics for the Future: Advanced Millimeter-Wave Multilayer Multichip Module Integration and Packaging,” in […]
Publications Guest Edited Focused Issue for IEEE Microwave Magazine (with TC-14): K. K. Samanta and D. Kissinger, “Heterogeneous Integration [From the Guest Editors’ Desk],” in IEEE Microwave Magazine, vol. 18, no. 2, pp. 14-16, March-April 2017 Invited Paper: K. K. Samanta, “Pushing the Envelope for Heterogeneity: Multilayer and 3-D Heterogeneous Integrations for Next Generation Millimeter- […]
