Substrate Integrated Circuits (SICs) – A Paradigm for MHz-to-THz (MTT) Electronic and Photonic Systems

  • Date of original webcast
    Tuesday, October 11, 2016
  • Duration
    59 minutes


Widespread applications and commercial success of GHz and THz electronic and photonic devices and systems, including RF, microwaves, and millimeter-waves are closely related to their manufacturing cost and antenna-circuit integration. Our proposed integration technology of planar and non-planar structures as well as related new progress indicate that the emerging substrate integrated circuits (SICs) are able to provide unprecedented advantages for developing low-cost GHz/THz components, antennas, circuits and systems as well as wireless photonic applications.

This webinar will review state-of-the-art and underlying features of the proposed integration platforms for designing the next generation RF/millimeter-wave/THz ICs and systems. Challenging issues and future directions will be discussed for R&D opportunities. Potential problems and possible solutions will also be presented.

It is believed that the technological platform of SICs will offer a cost-effective and performance-promising solution for mass commercial applications. With the development of innovative fabrication processes and material synthesis techniques, unique hybrid and monolithic high-density integration of planar and non-planar structures (or system-on-substrate approach) become realizable. It can also be demonstrated that this scheme of SICs may be able to effectively bridge the gap between electronics and photonics. In this presentation, global research activities and future RF/millimeter-wave developments will be discussed.


Ke Wu
Ke Wu

Dr. Ke Wu (Fellow, IEEE) received the B.Sc. degree (Hons.) in radio engineering from Nanjing Institute of Technology (now Southeast University) in 1982, the D.E.A. degree (Hons.) and the Ph.D. degree (Hons.) in optics, optoelectronics, and microwave engineering, all from the Institut National Polytechnique de Grenoble (INPG) and University of Grenoble, France, respectively in 1984 and 1987. He is currently the Industrial Research Chair in Future Wireless Technologies and Professor of Electrical Engineering with the Polytechnique Montréal (University of Montreal), where he is also the Director of the Poly-Grames Research Center. He was the Canada Research Chair in RF and millimeter-wave engineering and the Founding Director of the Center for Radiofrequency Electronics Research of Quebec. Dr. Wu has graduated over 75 Ph.D. and 95 M.Sc. Students. He has authored/co-authored over 1400 referred papers, and a number of books/book chapters and filed more than 80 patents. Dr. Wu was the General Chair of the 2012 IEEE MTT-S International Microwave Symposium, and the 2016 President of the IEEE Microwave Theory and Techniques Society (MTT-S). He also served as the inaugural representative of the North America in the General Assembly of the European Microwave Association. He was the recipient of many awards and prizes including the 2021 EIC Julian C. Smith Medal, 2022 IEEE MTT-S Outstanding Educator Award, and 2022 IEEE AP-S John Kraus Antenna Award. He was an IEEE MTT-S Distinguished Microwave Lecturer. Dr. Ke Wu is a Fellow of the Canadian Academy of Engineering and the Royal Society of Canada, and a Member of National Academy of Science and Engineering of Germany.

Michael C. Hamilton
Michael C. Hamilton

Dr. Michael C. Hamilton is an Associate Professor in the Electrical and Computer Engineering Department at Auburn University and the Assistant Director of the Alabama Microelectronics Science and Technology Center.