Millimetre-wave and 5G multilayer/3D Integration and Packaging: Advanced Technologies and Techniques
Date of original webcast: Tuesday, April 30, 2019
Duration: 60 minutes
There are ever-growing demand of millimeter-wave (mmW) and sub-mmW, including those for next-generation high-speed wireless (together with 5G) and multimedia, space/satellite, defense, automotive radar, sensors, and biomedical devices. The key challenges for making these applications feasible are realizing high-performance and highly integrated circuits/modules with ever greater functionality within a reduced size and mass at a low cost. Recent advancement in a multilayer multi-chip module (MCM) and 3D monolithic/wafer-scale heterogeneous integration (3DHI) and packaging technologies are considered to be the viable solution towards addressing these requirements.
This webinar will first present the integration and packaging challenges, and widely used multilayer MCM (including LTCC, organic/laminate, and BCB/IPD) and 3D heterogeneous (including monolithic, chiplet and wafer-bonding/epitaxial-transfer) integration/packaging techniques. Then will show their recent advancements and relative advantages and limitations, in terms of integration capability, material properties, achievable feature size, RF performance and cost. However, at mmW, it is difficult to realize a circuit/module with the required quality economically. This talk will present an advanced multilayer/3D thick-film based technology which is very straightforward, cost-effective and demonstrated high-performance at mmW. The test results for a range of compact passives and SIW components, circuits, and highly integrated modules will be shown with performance superior to most of the reported results from MCMs, and operating from 1 GHz to 200 GHz. These will include the world’s first highly compact complete 60 GHz receiver, integrating MMICs with SIW antenna and filters, lumped components, and other passives into a single substrate. Further, will present the importance and recent advancements in packaging materials (TIM, heat spreader, epoxy, overmolded plastic) and die level packaging (including for PA) techniques with better thermal management.
Finally, the advanced performnce of 3DHI (to 320 GHz) and relative capabilities of 3DHI and multilayer MCM technologies with their application spaces will be detailed. Speaker will highlight the future trends with possible solutions for overcoming the multidisciplinary industrial challenges towards making the next-generation microwave and mm-wave applications feasible and affordable.