3D-/4D-/Inkjet-Printed RF Components and Modules for IoT and Smart Skins

Numerous inkjet-/3D-printed flexible antennas, RF electronics and sensors fabricated on paper and other polymer (e.g.LCP) substrates offer a system-level solution for ultra-low-cost mass production of Millimeter-Wave Modules for Communication, Energy Harvesting and Sensing applications. Prof. Tentzeris will explore:

• State-of-the-art area of 3D/inkjet-printed fully-integrated wireless sensor modules on paper or flexible substrates and demonstrate the unique capabilities of additive manufacturing for the fully 3D integration of arbitrary-shape wireless sensors with RF systems on virtually every substrate (glass, paper, plastic, …)
• The first realizations of 4D (morphing/shape changing/origami) multilayer RF/microwave structures, that could potentially set the foundation for the truly convergent wireless sensor ad-hoc networks of the future with enhanced cognitive intelligence and “rugged” packaging.
• Power sources of “near-perpetual” RF modules, including flexible miniaturized batteries as well as energy harvesting approaches involving thermal, EM, vibration and solar energy forms.
• mmW wearable (e.g. biomonitoring) antennas and RF modules, as well as the first examples of the integration of inkjet-printed nanotechnology-based (e.g.CNT) sensors on paper and organic substrates for Internet of Things (IoT), 5G and autonomous vehicles applications.
• Newly developed 3D ramp interconnects and on-chip/on-package printed RF components for further miniaturization and enhanced reliability. It has to be noted that the paper will review and present challenges for inkjet- and 3D-printed organic active and nonlinear devices and printable transparent RF electronics as well as future directions in the area of environmentally-friendly (“green”) RF electronics and “smart-skin’ conformal sensors.

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