Xun Luo received the B.E. and Ph.D. degrees in electronic engineering from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2005 and 2011, respectively.
From 2010 to 2013, he was with Huawei Technologies Co., Ltd., as the Project Manager to guide R&D Projects of multi-band microwave/mm-wave integrated systems for backhaul and wireless communication. Since 2015, he has been with UESTC as a Full Professor and appointed as the Executive Director with the Center for Integrated Circuits. Before joined UESTC, he was an Assistant Professor with the Department of Microelectronics, Delft University of Technology. He has authored or co-authored more than 80 journal & conference papers. He holds 24 granted patents in the area of wireless application. His current research interests include the RF/microwave/mm-wave integrated circuits, multiple-resonance THz modules, reconfigurable passive circuits, smart antennas with sensor network, artificial-intelligence microsystems, multi-function backhaul/wireless application, and system in package.
Dr. Luo is a Technical Program Committee Member of the IEEE International Microwave Symposium (IMS), the IEEE Radio Frequency Integrated Circuits Symposium (RFIC), and the IEEE International Wireless Symposium (IWS). He is also the Technical Committee member of MTT-5 on Filters and MTT-23 on Wireless Communications. He was bestowed by China as the China Overseas Chinese Contribution Award in 2016. He was also the recipient of the UESTC Distinguished Innovation and Teaching Award in 2018 and the UESTC Outstanding Undergraduate Teaching Promotion Award in 2016. His research group BEAM X-Lab received multiple Best Paper Awards and Best Design Competition Awards, including the IEEE IWS Best Student Paper Award in 2015 and 2018, the IEEE RFIT Best Student Paper Award in 2016 and 2019, the IEEE IMS Best Student Design Competition Award from 2017 to 2019, the IEEE IMS Sixty-Second Presentation Competition Award in 2019, and multiple Best Paper Award finalists of IEEE conferences. He was the TPC Co-Chair of IEEE IWS in 2018 and IEEE RFIT in 2019. He serves as a Track Editor for the IEEE Microwave and Wireless Components Letters and is also an Associate Editor of the IET Microwaves, Antennas & Propagation.