Steve Mung

Steve Wai Yin Mung received the B.Sc. (with first-class honor) in Applied Physics from City University of Hong Kong (CityU) in 2006. He also received the M.Phil. and Ph.D. degrees in Department of Electronic Engineering from CityU, in 2009 and 2012, respectively. He has more than 20 years of industrial experience in operations, design and manufacturing from semiconductors (power amplifier modules for mobile applications) to consumer products. He is currently Research Assistant Professor (Research and Development Office, The Education University of Hong Kong, EdUHK) and Adjunct Associate Professor (Department of Electrical and Electronic Engineering (EEE), the University of Hong Kong, HKU and Department of Electronic and Information Engineering (EIE), The Hong Kong Polytechnic University, PolyU). He is the co-founder and company representative in PolyU – Innovation Technology (HK) Audio and Speech Signal Processing Joint Laboratory. He has published and invented more than 100 journals, conference papers, China/US patents related to wireless/speech/audio technologies. He is also an associate editor of IEEE Consumer Electronics Magazine (CEM) and a member of reviewing board in The MTT-Sat Challenge. He serves as reviewer for several IEEE journals and technical committee member of MTT-S TC-4 Microwave Passive Components and Transmission Line Structures, Audio/Video Systems and Signal Processing (AVS)/Smartphone and Mobile Device Technologies (MDT) Technical Committees in the IEEE Consumer Technology Society (CTSoc) and Instrument Science and Technology Group Committee in Institute of Physics (IOP).

He is Fellow of the Institution of Engineering and Technology (FIET), Fellow of the Institute of Physics, Fellow of Institute of Science and Technology, Senior Member of IEEE, Chartered Engineer (Engineering Council, UK) and Chartered Scientist (Science Council, UK). His research interests include microwave/millimeter-wave integrated circuits and devices, antenna design, IoT applications and wireless communication.

This talk focuses on the miniaturization of microwave passive matching networks in 5G-and-beyond wireless systems. Building on recent advances in integrated PA packaging, the physical size of matching networks has emerged as a key limitation to further front-end miniaturization. To address this challenge, passive miniaturization techniques are presented that combine integrated passive components with bondwires treated as functional three-dimensional inductive elements. By co-designing lumped and distributed passive circuits with bondwire-based interconnect structures, compact impedance-matching networks can be realized with significant size reduction. Key design considerations, including electromagnetic coupling, broadband matching behavior, parasitic control, and fabrication tolerance, are discussed from a passive and transmission-line perspective.

Representative examples illustrate how bondwire-assisted passive integration enables reduced matching-network size while maintaining microwave performance required for 5G-and-beyond front-end circuits. This work highlights the role of miniaturization techniques on passive structures and transmission-line in advancing compact microwave front-end designs,