Songbin Gong

Songbin Gong


University of Illinois at Urbana Champaign Department of Electrical and Computer Engineering N 208 Wright St, Urbana, Champaign, 61801, USA


  • 2022, Microwave Prize, Past Awardees**
  • Member, TC-6 RF MEMS AND MICROWAVE ACOUSTICS, Technical Committees**
  • Topic Editor, JMW Editors, Journal of Microwaves, Publications**


Dr. Songbin Gong received his B.S. degree in Electrical Engineering from Huazhong University of Science and Technology, China, in 2004, and Ph.D. degree in Electrical Engineering from the University of Virginia, Charlottesville, VA, USA, in 2010. He is currently an Associate Professor and an Intel Alumni Fellow with the Department of Electrical and Computer Engineering and Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana–Champaign, Urbana, IL, USA.

His research primarily focuses on the design and implementation of MEMS and acoustic devices, components, and subsystems for RF front ends. In addition, his research explores hybrid microsystems based on the integration of MEMS devices with circuits or photonics for signal processing. He is a recipient of the 2014 Defense Advanced Research Projects Agency Young Faculty Award, the 2017 NASA Early Career Faculty Award, 2019 Dean’s Award for Excellence in Research at UIUC, and 2019 IEEE Ultrasonics Early Career Investigator Award. Along with his students and postdocs, he received the Best Paper Awards from the 2017 and 2019 IEEE International Frequency Control Symposium and the 2018 and 2019 IEEE International Ultrasonic Symposium and the 2nd place in the Best Paper Competition at 2018 International Microwave Symposium. He has been an associate editor for IEEE T-UFFC and JMEMS, and also the Technical Committee Chair of MTT-6 RF-MEMS and Microwave Acoustics of the IEEE Microwave Theory and Techniques Society.

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