Ryan Cadwell

Ryan Cadwell


TTM Technologies

Syracuse, NY, United States


  • Affiliate Member, TC-8 RF NANOTECHNOLOGY, Technical Committees**


Ryan Cadwell received his B.S. and M.S. degrees in Electrical Engineering from Binghamton University in 2018 and 2020, respectively. In his undergraduate capstone work, for the Center for Advanced Microelectronics Manufacturing (CAMM), he led a team developing an in-line inspection system for roll-to-roll processing of thin film electronics – inspecting for damage, film thickness, etc. Between his B.S. and M.S. work, he was involved with Applied Materials’ flexible electronics research and development facility in Bavaria, Germany. There, he worked with a self-aligned imprint lithography process for precise roll-to-roll patterning of multilayer flexible electronics. During his M.S. work, also at CAMM, he focused on additively fabricated microwave electronics on flexible substrates. His primary focus was on aerosol jet printed components, as a part of an Air-force Research Laboratory (AFRL) funded NextFlex Consortium project. He also spent time in a BioMEMS and Bioelectronics course researching neuroelectronic interfacing and generating an idea for a novel probe geometry to potentially improve interface depth and reliability. Afterwards, he worked as an RF Engineer on design of and manufacturing support of circuit boards for radar and satellite communication systems at TTM Technologies, Syracuse (formerly Anaren). Currently, he conducts mm-wave propagation research at a radio technologies research group in Corning.

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