Biography
Philip Pieters (S’93) received the Industrial Engineering degree and the M.S. degree in electrical engineering from the Catholic University of Leuven, Leuven, Belgium, in 1991 and 1994, respectively.
In 1994, he joined the High Density Interconnection and Packaging Group, Interuniversity Microelectronics Centre (IMEC), Leuven, Belgium, where he initiated research on integrated passives in multilayer thin-film MCM-D technology. Since April 2000, he has been with the Technology Development Department, CS2 (a semiconductor assembly and test foundry), Zaventem, Belgium, where he is responsible for high-frequency development projects.