Paolo Manfredi received the M.Sc. degree in electronic engineering from the Politecnico di Torino, Turin, Italy, in 2009, and the Ph.D. degree in information and communication technology from the Scuola Interpolitecnica di Dottorato, Politecnico di Torino, in 2013. From 2014 to 2017, he was a Post-Doctoral Research Fellow of the Research Foundation–Flanders (FWO) with the Electromagnetics Group, Department of Information Technology, Ghent University, Ghent, Belgium. He is currently an Associate Professor with the EMC Group, Department of Electronics and Telecommunications, Politecnico di Torino. His research interests comprise the several aspects of circuit and interconnect modeling and simulation, including statistical and worst-case analysis, signal integrity, and electromagnetic compatibility.
Dr. Manfredi was a recipient of the Outstanding Young Scientist Award at the 2018 Joint IEEE International Symposium on Electromagnetic Compatibility & Asia-Pacific Symposium on Electromagnetic Compatibility, the Best Paper Award at the 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, the Best Oral Paper Award and the Best Student Paper Award at the 22nd and 19th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, respectively, the Young Scientist Award at the XXX International Union of Radio Science General Assembly and Scientific Symposium, and an Honorable Mention at the 2011 IEEE Microwave Theory and Techniques Society International Microwave Symposium.