Michael C. Hamilton

Michael C. Hamilton

Status

  • Webinar Moderator, Subcommittee: Webinars, Education Committee, Standing Committees**
  • Education/Webinars, Subcommittee: Digital Content and Marketing Initiatives , Marketing and Communications Committee, Standing Committees**
  • Vice-Chair, MTT-7 MICROWAVE SUPERCONDUCTIVITY AND QUANTUM TECHNOLOGIES, Technical Committees**
  • Topic Editor, JMW Editors, Journal of Microwaves, Publications**
Contact
Auburn University

Biography

Michael C. Hamilton obtained a BSEE from Auburn University in 2000 and MSEE and PhD in Electrical Engineering from The University of Michigan in 2003 and 2005, respectively. From 2006 to 2010, he was a Member of Technical Staff at MIT-Lincoln Laboratory, where he worked on instrument-level and system-level projects for next generation geostationary imaging for weather satellite systems, testing and modeling of highly-scaled and environmentally-optimized CMOS devices subjected to extreme environmental conditions, and modeling, design, fabrication and test of advanced technologies for high-frequency RF sample-hold and analog-digital conversion circuits based on Fully-Depleted Silicon-On-Insulator (FD-SOI) transistors and CCD structures. Dr. Hamilton joined the Electrical and Computer Engineering Department of Auburn University as an Assistant Professor in 2010, was promoted to Professor in 2019. He is the Director of the Alabama Micro/Nano Science and Technology Center (AMNSTC), which is a micro/nano technology center at Auburn University funded by the State of AL. Dr. Hamilton is a Senior Member of IEEE and is the Auburn University IEEE Student Chapter Faculty Advisor. Dr. Hamilton is on the IEEE MTT-S Education Committee, Vice-Chair of MTT-7 Technical Committee on Microwave Superconductivity and Quantum Technologies Committee, and producer/moderator of the IEEE MTT-S Webinar Series. He is also currently serving as a Topic Editor of a new open access journal: IEEE Journal of Microwaves. His current interests and areas of research include: superconducting electronics technologies, micro/nano fabrication, packaging and integration of high-speed systems, signal and power integrity of densely-integrated systems, application of micro and nanostructures for enhanced performance of RF and microwave systems and packaging for extreme environments (both high and low temperature).

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