Maurizio Bozzi

Maurizio Bozzi

Contact

University of Pavia

Dept. of Electrical, Computer and Biomedical Engineering University of Pavia Via Ferrata, 5 – 27100 Pavia (Italy)

Status

  • 2013 - 2017, Letters Past Associate Editors, Microwave and Wireless Technology Letters, Publications**
  • 2020-2022, Transactions Past Track Editors, MTT Transactions, Publications**
  • 2024, Immediate Past Presidents, Ex-Officio Members**
  • 2024, Past Presidents, Ex-Officio Members**
  • Advisor, Working Group on China Strategy and Membership, Standing Committees**
  • Immediate Past President (Ex Officio), Subcommittee: Personnel, Operations Committee, Standing Committees**
  • Member, IMWS-AMP ExCom, Meetings and Symposia Committee, Standing Committees**
  • Member, NEMO ExCom, Meetings and Symposia Committee, Standing Committees**
  • Member, TC-4 MICROWAVE PASSIVE COMPONENTS AND TRANSMISSION LINE STRUCTURES, Technical Committees**
  • Past President, Budget Committee, Standing Committees**
  • Speakers bureau, TC-4 MICROWAVE PASSIVE COMPONENTS AND TRANSMISSION LINE STRUCTURES, Technical Committees**

Biography

Maurizio Bozzi received the Ph.D. degree in electronics and computer science from the University of Pavia, Pavia, Italy, in 2000. He held research positions with various universities worldwide, including the Technische Universitaet Darmstadt, Germany; the Universitat de Valencia, Spain; and the Ecole Polytechnique de Montreal, Canada. In 2002, he joined the Department of Electronics, University of Pavia, where he is currently a full professor of electromagnetic fields. He was also a Guest Professor at Tianjin University, China (2015-2017) and a Visiting Professor at Gdansk University of Technology, Poland (2017-2018). His main research interests concern computational electromagnetics, substrate integrated waveguide technology, and microwave passive components and sensors. He has authored or co-authored more than 200 journal papers and 380 conference papers. He co-edited the book Periodic Structures (Research Signpost, 2006) and co-authored the book Microstrip Lines and Slotlines (Artech House, 2013).

Prof. Bozzi was the 2024 President of the IEEE Microwave Theory and Technology Society (MTT-S) and he had several roles in the MTT-S Administrative Committee. He was also a member of the General Assembly of the European Microwave Association (EuMA) from 2014 to 2016. He was a Track Editor of the IEEE Transactions on Microwave Theory and Techniques, and an Associate Editor of the IEEE Microwave and Wireless Components Letters, the IET Microwaves, Antennas and Propagation, and the IET Electronics Letters. He was the General Chair of the IEEE MTT-S International Microwave Workshop Series-Advanced Materials and Processes (IMWS-AMP 2017), in Pavia, Italy, 2017, of the inaugural edition of the IEEE International Conference on Numerical Electromagnetic Modeling and Optimization (NEMO2014), in Pavia, Italy, 2014, and of the IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Integration Technologies, in Sitges, Spain, 2011.

Maurizio Bozzi is a Fellow of the IEEE. He received several awards, including the 2015 Premium Award for Best Paper in IET Microwaves, Antennas & Propagation, the 2014 Premium Award for the Best Paper in Electronics Letters, the Best Student Paper Award at the 2016 IEEE Topical Conference on Wireless Sensors and Sensor Networks (WiSNet2016), the Best Paper Award at the 15th Mediterranean Microwave Symposium (MMS2015), the Best Student Award at the 4th European Conference on Antennas and Propagation (EuCAP 2010), the Best Young Scientist Paper Award of the XXVII General Assembly of URSI in 2002, and the MECSA Prize of the Italian Conference on Electromagnetics (XIII RiNEm) in 2000.

Presentations

Emerging Trends in Technologies and Materials for Microwave Communication and Sensing

The emerging applications of RF and microwave technology, in conjunction with the Internet of Things (IoT), the new generation of mobile communication (5G and 6G), and the driving of autonomous vehicles and drones, pose new challenges and requirements to the development of modern systems for microwave communication and sensing.

These systems require higher operation frequency (30-100+ GHz), complete system integration (including active components, passive components, antennas), the availability of fast and simple design (to guarantee short time-to-market), as well as low-cost manufacturing technology (even for mm-wave devices).

Different solutions have been investigated and demonstrated for meeting the requirements of these new systems, including planar structures, substrate integrated waveguide (SIW) technology, 3D printed components, and hybrid solutions.

This talk will present a variety of examples of components, antennas, and systems, ranging from miniaturized SIW components to 3D printed structures and wearable devices and antennas. In all cases, design, manufacturing, and experimental results will be shown and discussed.

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