Madhavan Swaminathan

Madhavan Swaminathan



  • Member, TC-2 DESIGN AUTOMATION, Technical Committees**
  • Member, AI and Machine Learning Based Technologies for Microwaves Working Group, Technical Coordination & Future Directions Committee, Standing Committees**


Madhavan Swaminathan is the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE), Professor ECE with a joint appointment in the School of Materials Science and Engineering (MSE), and Director of the 3D Systems Packaging Research Center (PRC), Georgia Tech (GT). He also serves as the Site Director for the NSF Center for Advanced Electronics through Machine Learning (CAEML) and Theme Leader for Heterogeneous Integration, SRC JUMP ASCENT Center. He formerly held the position of Founding Director, Center for Co-Design of Chip, Package, System (C3PS), Joseph M. Pettit Professor in Electronics in ECE and Deputy Director of the Packaging Research Center (NSF ERC), GT. Prior to joining GT, he was with IBM working on packaging for supercomputers. He is the author of 500+ refereed technical publications, holds 32 patents, primary author and co-editor of 3 books, founder and co-founder of two start-up companies (E-System Design & Jacket Micro Devices) and founder of the IEEE Conference Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference sponsored by the EPS society. He is an IEEE Fellow and has served as the Distinguished Lecturer for the IEEE EMC society. He received his BE degree from Regional Engineering College, Tiruchirapalli (now NITT) in 1985 and MS/PhD degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively.

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