Biography
José Luis González-Jiménez is a Fellow and Research Director at CEA-Leti. He received the Diploma degree in telecommunication engineering from Ramon Llull University, Barcelona, Spain, in 1992, the M.Sc. degree in Telecommunications Engineering and the Ph.D. degree (Hons.) in electronic engineering from the Universitat Politecnica de Catalunya (UPC), Barcelona, in 1994 and 1998, respectively. He attained the “Habilitation à Diriger des Recherches – HDR” degree from Grenoble University, Grenoble, France, in 2013. From January to July 1999, he worked as a Guest Researcher with the University of Arizona, Tucson, AZ, USA, where he collaborated with Motorola on the design of high-speed digital-to- analog converters. From September 2007 to August 2008, he was a Visiting Researcher with the STMicroelectronics/CEA-Leti joint Advanced Research Laboratory, Minatec, Grenoble, where he was engaged in research on the design of millimeter-wave oscillators and substrate noise coupling in millimeter-wave CMOS integrated circuits (ICs). Until 2011, he was a full-time Associate Professor with the Department of Electronic Engineering, Universitat Politecnica de Catalunya, Barcelona. From 2015 to 2019, he was the Deputy Head of the RFIC Design Laboratory, CEA-Leti, Grenoble. He is also an Invited Lecturer at the Phelma Engineering School, Grenoble-Alpes University. He has been leading and participating in several international research projects and contracts with companies. He is the author of two books, three book chapters, more than 40 international journal articles, and more than 120 conference papers. He holds 23 patents. His research interests include very large-scale integration circuits and systems, mixed-signal/RF, millimeter-wave and sub-THz ICs, silicon photonics, and signal and power integrity in SoC and RFICs. Dr. González-Jiménez was awarded a Fulbright Fellowship and regularly collaborates as a reviewer in journals, including IEEE Journal of Solid-State Circuits, IEEE Transactions of Circuits and Systems (I and II), IEEE Microwave and Wireless Components Letters, Electronics Letters, and IEEE Transactions on Microwave Theory and Techniques, and serves regularly for the technical program committee of several international conferences, including ISSCC, ESSERC, EuMW and IMS. From 2023 to 2025 he was the IEEE CAS society representative at the Steering Committee of the IEEE Future Networks Technical Community. He is a IEEE Senior Member and a EUMA Member.