Eric Beyne was born on May 26, 1960, in Tienen, Belgium. He received the Electrical Engineering degree and Ph.D. degree in applied sciences from the Catholic University of Leuven, Leuven, Belgium, in 1983 and 1990, respectively. From 1983 to 1985, he was a Research Assistant at the Catholic University of Leuven. In 1986, he joined the Interuniversity Microelectronics Centre (IMEC), Leuven, Belgium, where he was involved with research on the interconnection of high-frequency digital circuits. He is currently the Head of the High Density Interconnection and Packaging Group, IMEC. Dr. Beyne is the secretary of the International Microelectronics and Packaging Society (IMAPS) Benelux Committee.