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Swiss Federal Institute of Technology Zurich (ETH Zurich), Switzerland
Gloriastrasse 35, 8092 Zürich, Switzerland
Status
- Affiliate Member, TC-12 MICROWAVE HIGH-POWER TECHNIQUES, Technical Committees**
- Affiliate Member, TC-17 Microwave Materials and Processing Technologies, Technical Committees**
- Members, Subcommittee: Social Media, Electronic Information Committee, Standing Committees**
- Vice-Chair, Electronic Information Committee, Standing Committees**
- Web Master Manager, Electronic Information Committee, Standing Committees**
Biography
Chenhao Chu received the M.S. degree (Hons.) in electronic information engineering from the City University of Hong Kong (CityU), Hong Kong, China, and the Ph.D. degree in electronic engineering from University College Dublin (UCD), Ireland.
He is currently a Lecturer and an Established Researcher with the Integrated Devices, Electronics, and Systems (IDEAS) Group, Department of Information Technology and Electrical Engineering (D-ITET), Swiss Federal Institute of Technology Zurich (ETH Zurich), Switzerland. His research interests include AI/ML-assisted RFIC design, silicon/III-V circuit co-design for heterogeneous integration, energy-efficient RF/mmWave/sub-THz integrated circuits, and antenna-in-package technologies for phased arrays.
Dr. Chu has received three awards in the IEEE Microwave Theory and Technology Society (MTT-S) High-Efficiency Power Amplifier Student Design Competition (HEPA-SDC): First Place at the 2022 IEEE Radio & Wireless Week (RWW 2022), Second Place at the 2021 IEEE/MTT-S International Microwave Symposium (IMS 2021), and Third Place at the 2022 IEEE/MTT-S International Microwave Symposium (IMS 2022). Two of his first-authored papers in IEEE Transactions on Microwave Theory and Techniques (T-MTT) were recognized among the journal’s “Most Popular and Downloaded Papers (2022–2023).” He also received the IEEE Solid-State Circuits Society (SSCS) Open-Source Ecosystem “Code-a-Chip” Travel Grant at ISSCC 2026 and the Best Student Paper Award (First Place) at the 19th Royal Irish Academy/International Union of Radio Science (RIA/URSI) Research Colloquium on Radio Science and Communications in 2022.
He serves as Vice Chair of the IEEE MTT-S Electronic Information Committee (EICo) and as an Affiliate Member of the IEEE MTT-S Microwave High-Power Techniques Committee (TC-12) and Microwave Materials and Processing Technologies Committee (TC-17). He has served on the Technical Program Committees of the IEEE/MTT-S International Microwave Symposium (IMS), IEEE Radio & Wireless Week (RWW), and Design, Automation & Test in Europe Conference (DATE), and has chaired technical sessions on AI-enabled RF design and optimization at IEEE IMS 2025 and IEEE IMS 2026. He is a 2026 IEEE MTT-S Outstanding Young Professional Lecturer.