Brian Markman

Brian Markman is a Senior Integration Engineer at Aeluma. Previously he was an Integration Engineer at Intel Corporation Components Research, where he worked on nano ribbon FET performance and scaling as well as Keysight Technologies, where he was responsible for a 0.5μm InP HBT platform. His research interests are  III-V photonic devices for sensing and high-speed transceivers, III-V RF devices for high frequency communication, and Si CMOS for digital logic. Dr. Markman received his B.S. degree in Materials Science & Engineering from Pennsylvania State University and his M.S. / Ph.D. in Electrical and Computer Engineering from University of California, Santa Barbara (UCSB) in 2020. At UCSB, he contributed to monolithic heterogenous integration development, InP-based tunneling field effect transistors, and InP-based MOS-HEMT technologies for 6G communication systems.