Bobby Chan

Bobby Chan


Nano Dimension


  • Member, TC-17 Microwave Materials and Processing Technologies, Technical Committees**


Bobby is an accomplished professional with extensive experience in the field of electronic engineering, specializing in hardware design and software development for additive manufacturing electronics. Bobby received a Bachelor of Engineering (Honors) in Electronic and Information Engineering from The Hong Kong Polytechnic University and a Master of Science in Computer Science from The Chinese University of Hong Kong in 2017 and 2022, respectively.

In 2017, Bobby joined ASM Pacific Technology Ltd as an Electronic Engineer, focusing on high-precision sensor design and development for motion systems. He was responsible for designing and testing various sensors, including LVDTs (Linear Variable Differential Transformers), magnetic encoders, and optical encoders. Additionally, he played a key role in developing hardware for experimental motor drivers and acted as a full-stack developer for web-based motion simulation systems and motor design automation. In 2019, Bobby served as an Electronic Engineer at BBPOS (a stripe company), contributing to the development of POS devices equipped with NFC, BLE, Qi charging, LED array displays, and Capacitor Sensors.

As a Senior Application Engineer at Nano Dimension USA Inc., Bobby has been instrumental in advancing the field of additive manufacturing electronics. His role involves designing and testing various electronic components such as Lab-on-Chip devices, microfluidics, IC packages, Interposers, and SIPs using cutting-edge technologies. He has played a pivotal role in global customer project support, collaborating with universities and industries to drive innovation in electronic design and manufacturing.

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