Atom O. Watanabe (IEEE Member) received his B.Eng. degree in applied physics from Keio University, Tokyo, Japan, in 2015, and M.S. and Ph.D. degrees in electrical and computer engineering from the Georgia Institute of Technology, Atlanta, GA, USA, in 2019 and 2020, respectively. From 2015 to 2020, he was with the 3D Systems Packaging Research Center, Georgia Institute of Technology, under the guidance of Profs. Rao R. Tummala and M. Swaminathan. As a Graduate Research Assistant at the RF/5G Glass Interposer Program, he was involved in design and demonstration of high-performance and ultrathin antenna-integrated 3-D glass-based millimeter-wave (mm-wave) packages. In 2020, he joined Qualcomm Inc., San Diego, CA, USA, as a packaging signal and power integrity engineer. Since 2021, he has been a Research Staff Member at IBM Thomas J. Watson Research Center in Yorktown Heights, NY. His research activities include antenna-in-package design and integration for mm-wave communication systems, 2.5D/3D chiplet and heterogeneous integration, co-packaged optics, and cryogenic packaging for quantum computing.