Anthony Ghiotto

Anthony Ghiotto (S’05–M’09–SM’15–F’26) received the M.Sc. and Ph.D. degrees (both with distinction) in microwave engineering from the Grenoble Institute of Technology, Grenoble, France, in 2005 and 2008, respectively. From 2009 to 2012, he held a Postdoctoral Research Associate position at École Polytechnique de Montréal, Montréal, QC, Canada.

In 2012, he joined the Department of Electronics at the ENSEIRB-MATMECA engineering school, Bordeaux Institute of Technology, where he has been the Chair since 2025. He is also with the Laboratory of Integration from Materials to Systems (IMS), University of Bordeaux, where he heads the Microwave Design Team. He is currently an Associate Professor with full habilitation to supervise research obtained in 2017. In 2016 and 2017, he was a Guest Professor at the University of Pavia, Pavia, Italy.

Dr. Ghiotto was the recipient of the IEEE MTT-S Outstanding Young Engineer Award in 2022, the IEEE/SEE Léon-Nicolas Brillouin Award in 2020, the IEEE SPI Young Investigator Training Program Award in 2016 and 2017, a Postdoctoral Fellowship from the Merit Scholarship Program for Foreign Students of the Fonds Québécois de la Recherche sur la Nature et les Technologies (FQRNT), Québec, Canada, in 2009, and the Young Scientist Award of the International Union of Radio Science (URSI) in 2008. His current research interests include the analysis, design, and integration of microwave and millimeter-wave passive and active circuits in PCB technologies (including SIW and air-filled SIW), BiCMOS and CMOS technologies, and dielectric waveguides.

Dr. Ghiotto served as the IEEE MTT-S Secretary in 2024 and is an elected AdCom Member for the 2025–2027 term. He is currently serving as IEEE MTT-S Vice-Treasurer and Vice-Chair of the MTT-S Technical Coordination and Future Directions Committee (TCFDC). He will serve as the General Chair of the 2030 European Microwave Week (EuMW). He was the Chair of the 2024 European Microwave Conference (EuMC) and the Technical Program Committee Chair EuMC 2019. He has served as an Associate Editor of the International Journal of Microwave and Wireless Technologies (EuMA) and is a regular reviewer for the IEEE Transactions on Microwave Theory and Techniques, IEEE Transactions on Antennas and Propagation, IEEE Microwave and Wireless Components Letters, and IEEE Antennas and Wireless Propagation Letters.

He served as Chair of the IEEE MTT-4 Microwave Passive Components and Transmission Line Structures Technical Committee and is a member of the MTT-1 Field Theory and Computational Electromagnetics Committee and the MTT-5 Filters Committee. Since 2017, he has been the Chair of the IEEE MTT-S France Chapter. He was the Counselor of the IEEE Student Branch of Bordeaux (BEE Branch) from 2012 to 2019 and is currently the Advisor of the IEEE MTT-S and AP-S BEE Branch Chapters.

Introduced in the early 2000s, the substrate integrated waveguide (SIW) technology, has trigged a huge interest from academia to industry with the focus on the design and development of low-loss, compact, integrated, self-packaged and low-cost microwave and millimeter-wave circuits, antennas and systems. However, the classical metallic waveguide technology, which offers better performances such as lower insertion loss and higher power handling, has still been used in the design of microwave and millimeter-wave systems, despite its higher cost and bulky structure. To offer a highly integrated, further loss-reduced, low-cost alternative to the conventional waveguide and also to allow a wide-spread use of the millimeter-wave spectrum, a new SIW structure called Air-Filled SIW (AFSIW) has been introduced. This new structure has been theoretically and experimentally studied in details with a substantial amount of results. At millimeter wave frequencies, compared to the SIW topologies, the proposed AFSIW scheme exhibits a substantially lower insertion loss (three times at Ka-band, for example) and a much higher average power handling capability (four times, at Ka-band for example). Numerous AFSIW passive components have been investigated designed and demonstrated, which take advantages of the well-established multilayer printed circuit board (PCB) fabrication process. Couplers, phase shifters, power dividers, antennas and filters have been modeled, designed, prototyped and measured based on the introduced technology. Their performances have theoretically and experimentally been compared with their SIW counterparts to demonstrate and validate the benefits of the proposed technology.