Silicon-based Millimeter-wave Phased Arrays for 5G: Fundamentals to Future Trends
Dr. Bodhisatwa Sadhu
IBM T. J. Watson Research Center, Yorktown Heights, New York.
Abstract: 5G cellular communications use millimeter-wave phased arrays to achieve high data rates and low latency. The majority of the 5G millimeter-wave infrastructure will be partially or completely based on silicon technology. This talk will discuss key aspects of silicon-based millimeter-wave phased-array module design and characterization. It will cover fundamentals of phased arrays, provide an overview of phased array antenna modules using silicon technology, and take a deep dive into an example 5G phased array antenna module. The talk will end with a peek into the future of 5G directional communications.
Speaker’s Bio: Bodhisatwa Sadhu received the B.E. degree in Electrical and Electronics Engineering from Birla Institute of Technology and Science – Pilani (BITS-Pilani) in 2007, and the Ph.D. degree in Electrical Engineering from University of Minnesota, Minneapolis, in 2012. He is currently a Research Staff Member with the RF/mm-wave Communication Circuits & Systems Group at IBM T. J. Watson Research Center, Yorktown Heights, NY, USA, and was an Adjunct Assistant Professor at Columbia University, NY from 2017 to 2020. At IBM, he has led the design and demonstration of the world’s first reported silicon-based 5G phased array IC, a low power 60GHz CMOS transceiver IC for 802.11ad communications, a software-defined phased array radio, and several low phase noise frequency synthesizers. He has authored and co-authored 60+ peer-reviewed papers, the book Cognitive Radio Receiver Front-Ends (Springer, 2014), and several book chapters. He also holds 60+ issued US patents. Dr. Sadhu currently serves as an IEEE Distinguished Microwave Lecturer, Sub-committee Chair and Steering Committee Member of IEEE RFIC Symposium, TPC member of IEEE ISSCC, and has served as Guest Editor of IEEE TMTT in 2021 and IEEE JSSC in 2017. Dr. Sadhu is the recipient of the 2022 IEEE MTT-S Outstanding Young Engineer Award, the 2017 ISSCC Lewis Winner Award for Outstanding Paper (best paper award), the 2017 JSSC Best Paper Award, the 2017 Pat Goldberg Memorial Award for the best paper in computer science, electrical engineering, and mathematics published by IBM Research, and five IBM Outstanding Technical Achievement Awards. He was recognized as an IBM Master Inventor in 2017 and 2021 (3-year terms each), and selected by the National Academy of Engineering for its Frontiers of Engineering Symposium in 2020.
This webinar is sponsored by Cadence: