Next-Generation Advanced Manufacturing for Aerospace Wireless Systems – From Conformal Metasurface Antennas to High-Temperature RF and Photonics Packaging

Eduardo A. Rojas-Nastrucci, PhD
Associate Professor
Electrical & Computer Engineering at Embry-Riddle Aeronautical University

Abstract: Over the last decade, the commercial space sector has experienced exponential growth, catalyzing significant advancements in wireless communication technologies. The unique challenges of the space environment impact the performance and reliability of wireless systems, particularly in terms of bandwidth, range, coverage, adaptability, and the survivability of electronics. This seminar aims to provide a comprehensive perspective on the state-of-the-art wireless technologies shaping the space industry and to discuss future trends and innovations in this dynamic field.

From an engineering viewpoint, achieving success in space-based wireless communications requires the integration of novel electromagnetic and mechanical co-design strategies, the development of advanced conductive and dielectric materials capable of withstanding harsh conditions, and the implementation of innovative manufacturing techniques. This presentation will delve into the intersection of next-generation advanced manufacturing processes for 3D and multilayer geometries and the specific challenges posed by the space environment to electronics and materials compatibility.

Key topics will include the latest advancements in 3D antennas and RF/photonic packaging, with a focus on cutting-edge Advanced Manufacturing (AM) processes such as micro-dispensing, two-photon polymerization, femtosecond laser machining, and aerosol jetting. These processes are crucial for developing high-performance wireless hardware suited for highly specialized low-volume space applications. Additionally, the seminar will explore aerospace-grade materials, emphasizing their electromagnetic and mechanical properties that ensure compatibility with space conditions. Finally, the talk will present practical examples of RF/photonic packaging and 3D conformal metasurface antennas, highlighting their potential to revolutionize space communications. Attendees will gain insights into the future directions of wireless technologies in the space industry and the innovative solutions driving this exciting frontier.

Speaker’s Bio: Eduardo Rojas earned his M.S. and Ph.D. degrees from the University of South Florida in Electrical Engineering in 2014 and 2017, respectively. He joined the Embry-Riddle Aeronautical University in 2017 as an associate professor. His research interests are microwave/millimeter-wave circuits and antenna applications using advanced manufacturing, wireless sensing for harsh environments, radio-frequency hardware security, and packaging for free-space optical communications devices. Rojas is the founder and co-director of ERAU’s Wireless Devices and Electromagnetics Laboratory (WIDE Lab www.wide-lab.com). He received a CAREER Award from the National Science Foundation in 2019; a 2022 Jet Propulsion Laboratory Faculty Fellowship; the 2020 Most Promising Engineer Award, Ph.D and Education category, from the Great Minds in Stem (GMiS) organization; ERAU’s 2021 Abas Sivjee Outstanding Research Award, and is a Senior Member of the National Academy of Inventors. Rojas has more than 50 peer-reviewed publications and 8 U.S. patents. Rojas is a member of the IEEE MTT-S Technical Committees 4, 26, and 29 and the RTCA SC-236 committee for Standards for Wireless Avionics Intra-Communication System (WAIC) within 4200-4400 MHz. Rojas was the general conference chair for the 2022 IEEE Wireless and Microwave Technology Conference (WAMICON) and is the general chair for the 12ᵗʰ Annual IEEE International Conference on Wireless for Space and Extreme Environments (WISEE 2024) and the 14th IEEE International Conference on RFID Technology and Applications.