Enabling Multi-Functional and Reconfigurable RF and Microwave Technologies with Integrated Thin-Films and Techniques

Guoan Wang
Professor
University of South Carolina

Abstract: The fastest growing wireless communications market has and will continuously see dramatic changes in both the requirements on, and the capabilities of radios to support the wireless connections especially in future 6G and beyond technologies. Multiple functional RF passive technologies are enabling new frontiers to support different communication standards in modern and next generation wireless communication systems. This webinar will present the development of frequency agile and electrically tunable miniaturized RF and microwave passive components enabling multifunctional and adaptive radios from the aspects of thin films integration (e.g., ferroelectric and ferromagnetic thin films), on-chip tuning techniques (e.g., diodes and transistors) and novel design structures. Design efficacy and applications will be demonstrated with thorough study of RF and microwave passives including reconfigurable and multi-functional transmission lines, phase shifters, filters, and antennas.

Speaker’s Bio: Guoan Wang received his Ph.D. in Electrical and Computer Engineering from Georgia Institute of Technology in 2006. He is currently a Professor in the Department of Electrical Engineering at the University of South Carolina. He worked as an Advisory Scientist responsible for the development of on chip mmwave passives and wafer level RF MEMS technologies in IBM Semiconductor Research and Development Center from 2006-2011. His current research areas include reconfigurable RF and microwave electronics, novel materials/techniques for smart RF applications, MEMS/NEMS, sensors and sensing systems, wireless energy harvesting, and 3D integrated devices/system. Dr. Wang’s research work has produced over 140 papers in peer-reviewed journals and conferences proceedings, one book (Smart RF Passive Components: Novel Materials, Techniques, and Applications, Artech House). He also holds over 60 granted US and international patents.

Dr. Wang served as an Associate Editor of IEEE Microwave and Wireless Components Letters from 2013 – 2019, and currently is an Associate Editor of International Journal of RF and Microwave Computer‐Aided Engineering. He is a member of the Technical Coordinating Committee for IEEE MTT TC-6 RF MEMS and Microwave Acoustics, chair of IEEE MTT TC-13 Microwave Control Materials and Devices, and vice-chair of IEEE MTT TC-17 Microwave Materials and Processing Technologies Committee. He has served on Steering Committees, Technical Program Committees, and as Session Chairs of many IEEE conferences including International Microwave Symposiums and IEEE Antennas and Propagation Symposium. Dr. Wang is a recipient of the NSF Early Faculty Development (CAREER) Award in 2012, IEEE Region 3 Outstanding Engineer Award in 2018.