23:44 BST
2024 IMS (Washington DC, USA), June 17 and 19, 2024
The prestigious IEEE Microwave Theory and Technology Society (MTT-S) flagship conference, the IEEE MTT-S International Microwave Symposium (IMS), held in Washington, D.C., once again featured the highly regarded IEEE MTT-S Inter-Society Technology Panel (ISTP) program.
This ISTP initiative aims to promote multidisciplinary collaboration and the exchange of ideas on pivotal cross-sector technologies within IEEE and beyond. Through panels focusing on emerging applications and future trends, the ISTP program facilitates coordinated presentations and vibrant discussions, integrating diverse perspectives from panelists with varied expertise. In this dynamic setting, participants engage in interdisciplinary dialogue and delve into cutting-edge R&D across multiple fields. The ISTP program serves as a vital platform for sharing knowledge, fostering enthusiasm, and collaboratively shaping the future of technology, inspiring innovation and cross-disciplinary synergies.
As was done in previous years, two ISTPs were organized for IMS2024.
1. Panel: Meeting IEEE Division IV Society Presidents
Organizer | ||
Alistair | Duffy | Director, IEEE Division IV |
Ke | Wu | Polytechnique Montréal |
J.-C. | Chiao | Southern Methodist University |
Panelists | ||
Thomas | Coughlin | 2024 IEEE President & CEO |
Branislav | Notaros | President of IEEE Antennas and Propagation Society |
Maurizio | Bozzi | President of IEEE Microwave Theory and Technology Society |
Gregory | Durgin | President of the IEEE Council on RFID (CRFID) |
Wen-Chung | Kao | President of IEEE Consumer Technology Society |
Gregory | Durgin | President of IEEE Council on RFID |
John | La Salle | President of IEEE Electromagnetic Compatibility Society |
Vesna | Sossi | President of IEEE Nuclear and Plasma Sciences Society |
Guy | Bouchard | President of IEEE Broadcast Technology Society |
2. Panel: Climate Change – A Global Grand Challenge
Organizer | |||
Ke | Wu | Polytechnique Montréal | Canada |
Steven | Reising | Colorado State University | USA |
J.-C. | Chiao | Southern Methodist University | USA |
Panelists | |||
Jean-Pierre | Raskin | Université Catholique de Louvain | Belgium |
Nils | Weimann | University of Duisburg-Essen | Germany |
Rabia Munsaf | Khan | State University of New York | USA |
Suleka | Chattopadhyay | Women in Engineering – Climate Change Committee | USA |
Peter | Siegel | California Institute of Technology | USA |
David | Kunkee | Aerospace Corporation | USA |
Al | Gasiewski | University of Colorado at Boulder | USA |
Please find the link to the report in Microwave Magazine https://ieeexplore.ieee.org/document/10994744.